Microelectronic Assembly Materials

Inseto supplies a comprehensive range of high‑performance microelectronic assembly materials used throughout semiconductor and advanced electronics packaging processes. These materials are selected to support demanding applications across power electronics, photonics, RF, MEMS, and advanced packaging, where reliability, thermal performance, and process consistency are critical.

Our materials portfolio supports key assembly stages including die attach, interconnection, encapsulation, thermal management, and package sealing, serving both R&D and high‑volume manufacturing environments and includes:

• ATP: Metalised thin‑film substrates, thin‑film circuits, resistors, transmission lines, and related microelectronic materials for RF, photonics, and high‑reliability electronics.
• Koartan: Thick film resistor, thermistor, conductive, and over‑glaze materials for hybrid circuits, high‑power electronics, and temperature sensing applications.
• AMETEK Coining: Precision solder preforms and ribbon, gold based eutectic alloys, bonding wire and ribbon materials, and precision metal materials for microelectronic packaging.
• DELO: Microelectronic adhesives for die attach, encapsulation, glob top, and dam and fill applications. Low‑CTE, high‑purity formulations for sensitive devices.
• Inventec: Advanced silver sintering materials for die, component and substrate attach, offering very high thermal and electrical conductivity, mechanical strength and lead free formulations.
• Egide: Hermetic glass‑to‑metal and ceramic‑to‑metal microelectronic packages, including HTCC, RF, optoelectronic, power, and thermal imaging package solutions.
• Inseto: An extensive ex‑stock range of semiconductor packages and lids, supporting fast turnaround requirements for research, prototyping, evaluation, and low‑volume production.