Bonding Wire and Ribbon
Coining, an Ametek company, is a world-class manufacturer of high-purity bonding wire and ribbon that include gold, silicon-aluminium, & pure aluminium wires & ribbons. These are extensively used in the manufacturing of semiconductor and microelectronic devices as the electrical interconnect either between a chip and substrate, between two chips, or between two substrates. All Coining ribbons are manufactured to a world-leading tolerance of ± 3%, minimising machine down-time due to oversized ribbon.
- Gold bonding wire, up to 99.99% purity, diameters from 12.5µm (0.0005″) to 125µm (0.005″)
- Gold ribbon, as thin as 6µm (0.00025″), with widths up to 625µm (0.025″)
- Fine 1% silicon aluminium bonding wire, from 18µm (0.0007″) to 75µm (0.003″)
- Aluminium bonding wire, up to 99.999% purity, diameters from 125µm (0.005″) to 500µm (0.020″)
- Aluminium ribbon, from 750µm x 75µm (0.030″ x 0.003″) to 2mm x 300µm (0.080″ x 0.012″)
- Other materials include silver and nickel bonding wires and ribbons
All materials used by Coining are of the highest quality, refined and alloyed to produce the properties demanded of finished wire and ribbon products.
Explore the Coining Range of Bonding Wire and Ribbon
Gold Bonding Wire
Coining manufactures Au bonding wires for low to high volume requirements with standards that are unsurpassed in the industry.
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Gold Bonding Ribbon
Coining produces ribbons of pure gold and base metals for microwave and other applications.
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Fine Si/Al Wire
Special controls are used in the manufacture of Coining 1% silicon-aluminium wire to assure uniform high quality bonds.
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Large Diameter Aluminium Bonding Wire
Heavy / large aluminium bonding wire for microelectronics and battery applications.
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Aluminium Ribbon
Coining produces ribbons of aluminium and base metals for power and other applications.
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Coining
See the full Coining product range.
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What is Wire Bonding?
Wire bonding is a core microelectronic assembly process used to create electrical interconnects between a semiconductor device and its package, leadframe, or substrate. The process uses a combination of controlled force, ultrasonic energy, and in some cases heat, to form a solid-state bond without melting the wire or the bond surfaces.
Key characteristics of wire bonding include:
- Creates electrical interconnects between semiconductor devices and packages
- The electrical interconnects enable signal, power, and ground connections
- Uses solid state bonding mechanisms based on ultrasonic energy and pressure
- Offers flexibility in interconnect materials including gold, aluminium and copper etc.
- Multiple bonding techniques such as ball bonding, wedge and ribbon bonding
- Proven reliability and cost effectiveness across a wide range of applications
For information on bonding wire and ribbon properties that should be considered when selecting a wire type, please refer to our Knowledge Base fact sheet: What is Wire Bonding?.
Knowledge Base Articles
Description
What is Wire Bonding? (IKB-015)
Further Information
Wiki – Wire Bonding Overview
Applications for Bonding Wire and Ribbon
Wire Bonding, Ribbon Bonding, Battery Assembly, Material Interconnect, etc.
Industry Segments
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices
Coining Website
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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