Vacuum Reflow Ovens by ATV Technologie
ATV’s solder reflow ovens (SRO) with rapid thermal annealing (RTA), soldering and brazing capability are multi-purpose “cold wall” process ovens heated by IR filaments. The SRO is ideal for R&D and process development, low to high volume production, with models including bench-top through stand-alone to fully automated high volume systems.
Applications include void-free solder die and substrate attach for power semiconductor and hybrid module assembly, formic vacuum solder reflow, hermetic package lid sealing, flux or flux-less soldering, eutectic solder reflow, high vacuum encapsulation, high temperature processing, getter activation, diffusion and compression bonding etc.
See our “Knowledge Base Document” for a guide to the basics of flux-less solder reflow using Formic Acid.
SRO-700 Table Top Vacuum Solder Reflow Oven
Ideal for Research and Development or low to medium volume production.
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SRO-716 Batch Vacuum Solder Reflow Ovens
For thermal transfer applications requiring processing under vacuum or with process gases.
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SRO-iLine Production Vacuum Solder Reflow
For high volume vacuum solder reflow of power module and microelectronic devices.
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SRO-Getter – Package Lid Sealing System
Designed for sealing high reliability microelectronic and related packages.
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ATV Technologie
See the full ATV Technologie product range. ATV are a Kurtz Ersa Semicon company.
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Further Information
What is a Vacuum Reflow Oven?
A vacuum reflow oven is a specialized thermal processing system designed to solder components in a controlled environment where air and contaminants are removed using vacuum technology. This process significantly reduces oxidation and void formation in solder joints, ensuring superior reliability and performance for sensitive electronic assemblies.
Key benefits include:
- Void Reduction: Minimizes air pockets in solder joints for improved thermal and electrical conductivity.
- Oxidation Control: Vacuum and chamber conditions prevent oxidation, resulting in cleaner, stronger connections.
- Precision Temperature Profiles: Enables accurate thermal management for complex assemblies and advanced packaging.
Vacuum reflow ovens are widely used in high-reliability sectors such as aerospace, automotive, and semiconductor manufacturing, where quality and durability are critical.
Inseto Knowledge Base Document:
Read our guide to the “How IR Induction Furnaces Work“
Wiki – Semiconductor Device Fabrication
Vacuum Reflow Applications
Vacuum reflow ovens are used across a wide range of advanced packaging and assembly processes, including: Semiconductor & Power Electronics for die attach, IGBT/DBC soldering, wafer-level packaging, flip chip, 3D-CSP, MMIC die attachment and getter activation.
Industry Segments
RF & Microwave Electronics, Power Semiconductor, Sensor Fabrication, Universities R&D, Medical, Photonics, Solar Cell, Photo Voltaic and Aerospace and Hi-Reliability Devices etc.
ATV (A Kurtz Ersa Semicon Company) Website
https://kurtzersa.com/products/electronics-production/semicon
Region
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark
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