Date
April 2026
Description
SAW device manufacturer Transense adds a new precision automatic die bonder from Inseto to their UK manufacturing facility.
Link
News & Events
Further information about our Company, website and events including:
News – View all of our current news announcements.
Press Releases – View copies of all our latest press releases.
Exhibitions & Events – See below a list of all relevant exhibitions & events we are attending this year.
Latest News
Date
Description
Date
April 2026
Description
PacTech led discussions at MicroTech 2026 by highlighting how laser enabled soldering and bonding processes are reshaping advanced semiconductor packaging strategies.
Link
Date
April 2026
Description
Engineering Intelligently will bring together engineers and industry leaders to explore mentoring, leadership, retention, and the impact of emerging technologies such as AI on modern engineering careers.
Link
Date
March 2026
Description
Driving Innovation in Semiconductor Packaging is the theme of the IMAPS-UK MicroTech Annual Conference, proudly sponsored by Inseto this year.
Link
Date
March 2026
Description
Tresky’s latest High Precision Die bonder enables the assembly of “Next Generation Photonic” devices at G&H Torquay
Link
Date
January 2026
Description
Gary’s appointment strengthens our ongoing commitment to providing reliable, responsive and technically proficient support to our customers.
Link
Exhibitions
Date
Description
Date
19 – 21 August, 2026
Description
NanoFabUK Symposium, Royal Geographical Society in London, UK
Link
Date
26 August 2026
Description
TechWorks – Semiconductor to Systems Summit 2026, London, UK
Link
Date
02 September, 2026
Description
IMAPS-UK Academic Conference, University of Warwick
Link
Date
09 – 11 Sept., 2026
Description
IEEE ESTC 2026 – Electronic Systems-Integration Technology Conference, Helsinki, Finland
Link
Date
29 – 30 Sept., 2026
Description
Microelectronics UK, Excel London, UK – Stand E32
Link
Date
10 – 13 November, 2026
Description
Semicon Europa, co-located with Electronica, Munich, Germany – Booth C2-122
Link
Date
18 November 2026
Description
REWIRE Showcase 2026, Bristol, UK
Link
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