Dispensing Equipment by Kulicke & Soffa
Kulicke and Soffa produce a range of high speed, precision and micro dispensing equipment for bonding, sealing and coating applications in the semiconductor, automotive, battery, display and PCB industries etc.
Custom configured to suit the process requirements, dispense options include a Piezo Jet Valve, Progressive Cavity Pump, Deposition Pump, Solder Paste Jetting Valve, Thin Film Ultrasonic Spray Coater, 10:1 High-Precision Mixing-Dispensing and High-Precision Air Spray etc.
Process control features include real time quality checks with 2D/3D embedded AOI plus defect mapping, on-the-fly calibration, combined with high speed and performance to ± 1 micron with 3 sigma repeatability at the needle. These capabilities ensure higher dispense and coating accuracies, resulting in smaller keep-out-zones and buffer regions.
A multiple valve capability with up to four dispense heads for different materials or processes, plus a wide range of equipment models, from bench top through inline systems, provides a versatile solution for almost any dispensing application.
Desktop Dispensing Robot Series
The Desktop Dispensing Robot Series delivers accuracy and reliability with a 300 x 300mm dispense area.
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ACELON
A versatile fully automatic jet dispense system with built-in AOI capabilities.
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SL Series
Designed for semiconductor micro dispensing applications with a small machine footprint.
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XLS Series
Developed for micro dispensing applications that require extreme repeatability and accuracy.
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K&S – Kulicke and Soffa
See the full K&S product range
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Further Information
What is Adhesive Dispensing Equipment?
Adhesive dispensing equipment is used to apply controlled and repeatable amounts of adhesives, encapsulants and other materials during manufacturing and assembly processes. These systems are designed to deliver precise material placement to support consistent bond quality, process reliability, and production efficiency.
Depending on the application, adhesives may be applied using contact based dispensing methods or non contact techniques such as jet dispensing, allowing manufacturers to select the most appropriate approach based on material properties, component sensitivity, and production requirements.
Key characteristics of an adhesive dispensing system:
- Compatible with a broad range of chemistries and material viscosities
- Handles materials presented in bulk canister or syringe formats
- Automates dispensing from the adhesive container
- Provides programmable parameters to optimise the dispense process
Inseto Knowledge Base Document:
Read our free guide to the “What is Adhesive Dispensing”
Dispensing Applications
Dam and Fill, Micro-LED, Solder Paste Jetting, SMT Adhesive Dispense, Encapsulation, Potting, Underfill, LCD display, Camera Lens Bonding, Sealing, Conformal Coating, Microelectronic Assembly, Chip-on-Board, Battery Pack Assembly etc.
Industry Segments
Semiconductor, Electronics, Automotive, Aerospace, Military, Display, Telecommunications, Medical Electronics, Photonics, PCB Assembly Industries
Kulicke & Soffa (K&S) Website
Region
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark
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