Die Bonder Equipment by Tresky AG
Tresky AG, headquartered in Switzerland, is a leading manufacturer of die bonder and micro-assembly equipment. Tresky’s systems are used widely in R&D, pilot production, and advanced packaging across the microelectronics, optoelectronics, and related semiconductor sectors.
With over four decades of expertise, Tresky AG is recognised globally for its continual innovation and high quality range of manual and semiautomatic, die attach equipment.
Engineered for Precision and Versatility
Tresky’s die bonders are meticulously engineered to deliver exceptional accuracy, flexibility, and long-term reliability. Whether you’re operating in a research lab, managing low-volume production, or working within advanced semiconductor assembly, these systems are designed to meet the most demanding requirements.
Each machine from Tresky supports a comprehensive range of die attach processes, making them ideal for diverse applications in microelectronics and optoelectronics. These processes include eutectic bonding, epoxy and adhesive bonding, soldering, flip chip bonding, sintering, anisotropic conductive bonding, and thermosonic bump bonding. This broad capability ensures that Tresky’s equipment can adapt to evolving process requirements and material specifications across various industries.
Advanced Die Sorting Functionality
When configured with wafer die eject capabilities, the systems also excel in die sorting. They enable precise placement of die or laser bars into waffle packs, gel packs, and other carriers – ideal for prototyping, device evaluation, or packaging workflows.
Featured Die Bonder Models
- T-4909-AE Manual Die Bonder: A cost-effective model, ideal for research and development.
- T-5100 Manual Die Bonder & Die Sorter: High-precision manual system for low-volume environments.
- T-5300 Semiautomatic Die Bonder: A flexible platform for standard and advanced packaging.
- T-5500 High Force Die Bonder: Designed for high-force bonding up to 100kg, perfect for sintered applications.
- Flip Chip Bonding Systems: High-accuracy alignment and bonding plus device-to-device integration.
Die Bond Expertise
Inseto are the exclusive technical distributor and provide full support and application engineering for equipment throughout the United Kingdom, Ireland & Nordic Regions (including: Finland, Sweden, Norway & Denmark):
- Expertise in die bonding process development and optimisation
- On-site training and installation services
- Custom tooling, bonding collets and pickup tools
- Fast delivery of spare parts and consumables
- Decades of experience in microelectronics and semiconductor assembly
- Comprehensive after-sales support, including maintenance and calibration
Need help choosing the right die bonder or tools for your die attach process? Our team is ready to assist with expert guidance and solutions, to get in touch: enquiries@inseto.co.uk or call: +44 1264 334505.
T-4909-AE Manual Die Bonder
The T-4909-AE is a low cost, high quality manual model with superior ergonomic design.
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T-5100 Manual Die Bonder & Die Sorter
High performance manual die attach / die sort equipment, ideal for R&D and low volume applications.
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T-5300 Semiautomatic Die Bonder
Flexible system with semi-automatic process capabilities for standard and advanced packaging applications.
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T-5500 High Force Die Bonder
Low to high force bonding up to 100kg, ideal for sintered or flip chip die attach processes.
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Flip Chip Bonder
Systems and options designed for bonding bumped die, or for devices requiring high-precision, device-to-device alignment.
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Further Information
What is a Die Bonder?
A die bonder is a specialised machine used in semiconductor manufacturing to precisely pick and place individual semiconductor chips (known as “dies”) onto substrates, packages, or other carriers. This process, called die bonding or die attach, is a critical step in the post-fabrication phase of chip production, directly impacting device performance, reliability, and cost
Manual vs Semiautomatic Configurations:
Manual systems require an operator to align and place the die using a microscope and manual controls. These are ideal for R&D and low-volume production.
Semiautomatic systems automate the pickup and placement, offering higher throughput and consistency while still allowing operator control of the alignment processes.
Key Components of a Die Bonder:
- Microscope Alignment System: Used to align the die during pickup and placement.
- X/Y Stage: Operator controlled axis to move the die during pickup and placement.
- Z-Axis Control: Controls the vertical placement pickup and placement position.
- Pickup Tool and Vacuum System: A tool used to pickup and place the die.
- Substrate Holder: A fixture that secures the substrate or package during bonding.
- Beam Splitter (Optional): Used for flip-chip or high-accuracy bonding.
- Manual Controls and Interface: Controls for the operators interact with the system.
Inseto Knowledge Base Document:
Read our free guide to the “Die Attach Process: Guidance & Setup“
Wiki – Semiconductor Device Fabrication:
Semiconductor Device Fabrication overview – Wikipedia
Die Attach Applications:
Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Bio Medical Assembly, MEMS Device Attach, Sensors, Chip-on-Board, Multi-Chip-Module Assembly, Semiconductor Assembly, Device Development, RFID, MOEMS, VCSEL etc.
Industry Segments
Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices
Tresky AG Website
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