DELO DUALBOND Dual Curing Adhesives
DELO DUALBOND adhesives use UV or visible light to fix components in position within seconds, with a secondary heat or humidity cure completing the bond in shadow zones and enclosed areas where light cannot reach. Available from Inseto, the range is based on either epoxy or acrylate chemistry and covers bonding, sealing, potting, and encapsulation applications in electronics, automotive, microelectronics, and display manufacturing.
What is a Dual Curing Adhesive?
A dual curing adhesive uses two sequential cure mechanisms to complete a bond. The first cure is triggered by UV or visible light, fixing the components in their exact position within seconds without the need for fixturing or clamping. The second cure, heat or humidity depending on the grade, completes polymerisation across the full bond area, including any shadow zones where light could not reach during the initial fixation step.
The two stages serve different purposes in the production process. Light fixation is about speed and precision: it locks the assembly immediately, freeing it to move to the next stage of the line without waiting. The secondary cure is about completeness: it ensures the adhesive has fully polymerised everywhere in the joint, including beneath components, inside enclosures, and in any geometry that blocked the light source.
The key features of DELO DUALBOND dual curing adhesives include:
- Two-stage processing: UV or visible light fixation followed by heat or humidity secondary cure, allowing assemblies to move off-line before cure is complete
- Shadow zone coverage: secondary heat or humidity cure reaches areas the light source cannot, without relying on cationic dark cure chemistry
- Substrate flexibility: formulations available for bonding glass, metal, plastic, and ceramic substrates across a range of bond line thicknesses
- Epoxy and acrylate options: the range includes both epoxy-based and acrylate-based formulations, covering a wider range of mechanical and chemical performance requirements than a single chemistry range
- Process compatibility: initial light fixation eliminates the need for fixturing or clamping during secondary cure, reducing handling time and tooling costs on the production line
UV & Light Cured Adhesive Resources
File
DELOLUX 20 Series Area Curing Lamps Brochure
Download
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DELOLUX 30 Series Small Area Curing Lamps Brochure
Download
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DELOLUX 50 Series High-intensity Spot Lamps Brochure
Download
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DELO-DOT PN5 Series Microdispensing Valves and Cleaning Station Brochure
Download
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DELO-DIV Series Volumetric Dispensing Systems Brochure
Download
Eliminate Potential Movement of Parts
Using high-intensity light to fix the components in place eliminates any potential for movement of the parts relative to each other during the secondary heat or humidity cure.
Example dual cured adhesive applications include sealing compact camera modules, bonding RFID and smart labels and general applications in electronic assembly or other industries, which require short cycle times.
DELO DUALBOND Applications
DELO DUALBOND dual curing adhesives are used where production processes require immediate component fixation followed by complete polymerisation in geometries that prevent full light access to the bond area.
Camera Module Assembly
In camera module manufacturing, DELO DUALBOND adhesives fix lens barrels, sensor housings, and cover glass elements in position within seconds of light exposure, locking the optical alignment before secondary cure completes the bond. The two-stage process removes the need for fixturing during oven cure, reducing tooling requirements and supporting high-volume automated assembly lines.
MEMS and Microelectronics Packaging
DELO DUALBOND adhesives are used in MEMS packaging and microelectronics assembly for die attach, lid sealing, and component encapsulation where enclosed geometries prevent a single-stage UV cure from reaching the full bond area. Heat cure as the secondary mechanism ensures complete polymerisation inside sealed housings without exposing sensitive components to extended UV irradiation.
Sensor Potting and Encapsulation
In sensor manufacturing, DELO DUALBOND adhesives pot and encapsulate sensor elements inside housings where the adhesive is partially or fully obscured from the light source once dispensed. UV fixation holds the sensor element in position while secondary heat or humidity cure completes the encapsulant around it, maintaining positional accuracy through the full cure cycle.
Display Assembly
DELO DUALBOND adhesives are used in display integration and cover glass bonding where a fast initial fixation step is needed to hold glass layers in place before secondary cure completes the bond across the full panel area. Acrylate-based grades in the range support optically clear bonds in display applications where clarity through the adhesive layer is a performance requirement.
Automotive Electronics
In automotive electronics manufacturing, DELO DUALBOND adhesives seal and bond assemblies including control units, sensor housings, and connector elements where enclosed geometries require a secondary cure to achieve full polymerisation. Heat-curing grades support the elevated temperature resistance requirements of automotive applications, complementing the DELO KATIOBOND range for assemblies where the two-stage process better fits the production workflow.
Got a Question About UV or Light Cured Adhesives?
Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help.
From selecting the right UV or light cured adhesive to optimising your curing process, we provide technical guidance, documentation, and samples to support your application needs.
For information on choosing and working with dual-curing adhesives, please look at our Knowledge Base Fact Sheet here.
Example Applications using UV & Light Curing Adhesive
DELO DUALBOND UV & Light Curing Adhesive Product Range
DELO DUALBOND OB Optical Bonding Products
- Optimized for optical bonding
- Mechanics adjustable from tension-compensating to high-strength
- Fast light fixation for the alignment of components
- Dimensionally stable, reproducble curing shrinkage and low swelling behavior
- No condensable outgassing
- Used for: Automotive camera, consumer camera, LED packaging, HDD, etc.
Product OB749
Properties
3,150 Viscosity
Light and / or Heat Cured Epoxy
White / translucent
Complies with NASA outgassing requirements, low-temperature (80°C) heat curing for shadow zones, ideal for use in electronic applications
Product OB786
Properties
32,000 Viscosity
Light and / or Heat Cured Epoxy
Yellow / translucent
Complies with NASA outgassing requirements, meets ANSI/UL 94 HB flame test
Product OB787
Properties
46,800 Viscosity
Light and / or Heat Cured Epoxy
Yellowish / fluorescent
Low-temperature (80°C) heat curing for shadow zones, very low water absorption, bonds a very wide range of materials
Product OB6268
Properties
27,000 Viscosity
Light and / or Heat Cured Epoxy
Yellowish / transparent
Complies with NASA outgassing requirements, low-temperature (80°C) heat curing for shadow zones, very high Tg of 202ºC
Product OB6769
Properties
23,000 Viscosity
Light and / or Heat Cured Epoxy
Whitish / fluorescent
Complies with NASA outgassing requirements, meets ANSI/UL 94 HB flame test, meets ISO 10993-5 for cytotoxity
Product OB6773
Properties
30,000 Viscosity
Light and / or Heat Cured Epoxy
Beige / translucent
Low-temperature (80°C) heat curing for shadow zones, very low water absorption, bonds a very wide range of materials
Product OB6777
Properties
40,500 Viscosity
Light and / or Heat Cured Epoxy
Beige / fluorescent
Thermally conductive, complies with NASA outgassing requirements
Product OB6786
Properties
32,500 Viscosity
Light and / or Heat Cured Epoxy
Black / translucent
Low-temperature (80°C) heat curing for shadow zones, meets ANSI/UL 94 HB flame test
Product OB6789
Properties
125,000 Viscosity
Light and / or Heat Cured Epoxy
Yellowish / translucent
Low-temperature (80°C) heat curing for shadow zones, very low water absorption, bonds a very wide range of materials
Product OB6799
Properties
100,000 Viscosity
Light and / or Heat Cured Epoxy
Yellowish / translucent
Low-temperature (80°C) heat curing for shadow zones, very low water absorption, complies with NASA outgassing requirements
DELO DUALBOND LT Low Temperature Products
- Low curing temperature (Low Temperature)
- Very low outgassing
- Fast light fixation for aligning components
- Reproducible curing shrinkage and low swelling
- Used for: Camera Modules
Product LT354
Properties
145,000 Viscosity
Light & Heat Cured Epoxy
Grey opaque
Low-temperature (80°C) heat curing for shadow zones
Product LT2208
Properties
1,500 Viscosity
Light & Heat Cured Epoxy
Yellowish
Very low-temperature (60°C) heat curing for shadow zones
Product LT2215
Properties
6,200 Viscosity
Light & Heat Cured Epoxy
Black / opaque
Very low-temperature (60°C) heat curing for shadow zones
Product LT2266
Properties
53,000 Viscosity
Light & Heat Cured Epoxy
Black / opaque
Very low-temperature (60°C) heat curing for shadow zones, low water absorption, meets ISO 10993-5 for cytotoxity
Product LT2267
Properties
55,000 Viscosity
Light & Heat Cured Epoxy
Whitish / opaque
Very low-temperature (60°C) heat curing for shadow zones, very low water absorption
Product LT2268
Properties
60,000 Viscosity
Light & Heat Cured Epoxy
Black / opaque
Very low-temperature (60°C) heat curing for shadow zones, low water absorption, meets ISO 10993-5 for cytotoxity
Product LT2278
Properties
60,000 Viscosity
Light & Heat Cured Epoxy
Black / opaque
Very low-temperature (60°C) heat curing for shadow zones, low water absorption
Product LT2345
Properties
65,000 Viscosity
Light & Heat Cured Epoxy
Orange / opaque
Low-temperature (80°C) heat curing for shadow zones, low water absorption, ideal for bonding to nickel, complies with NASA outgassing requirements
DELO DUALBOND GE General Encapsulant Products
- Optimized for potting applications (General Encapsulant)
- Mechanics adjustable from tension-compensating to high-strength
- Optimized flow behavior
- Adjusted thermal coefficients of expansion
- Excellent media resistance
- Used for: Sensor potting, pin sealing, advanced packaging, etc.
Product GE710
Properties
16,000 Viscosity
Light and / or Heat Cured Epoxy
Beige / opaque
Low-temperature (100°C) heat curing for shadow zones
Product GE731
Properties
10,000 Viscosity
Light and / or Heat Cured Epoxy
Yellowish / translucent
Extended pot life, flexible, low-temperature (100°C) heat curing for shadow zones
Product GE4906
Properties
2,100 Viscosity
Light & Humidity Cured Acrylate
Yellowish / fluorescent
Extended pot life, very highly flexible, humidity curing for shadow zones, meets ISO 10993-5 for cytotoxity
Product GE4909
Properties
2,100 Viscosity
Light & Humidity Cured Acrylate
Red / fluorescent
Extended pot life, very highly flexible, humidity curing for shadow zones
Product GE4910
Properties
2,100 Viscosity
Light & Humidity Cured Acrylate
Colourless / transparent
Extended pot life, highly flexible, humidity curing for shadow zones, meets ANSI/UL 94 HB flame test
Product GE4912
Properties
5,500 Viscosity
Light & Humidity Cured Acrylate
Colourless
Extended pot life, highly flexible, humidity curing for shadow zones, meets ANSI/UL 94 HB flame test
Product GE4923
Properties
90,000 Viscosity
Light & Humidity Cured Acrylate
Colourless / fluorescent
Extended pot life, flexible, humidity curing for shadow zones
Product GE4926
Properties
10,000 Viscosity
Light & Humidity Cured Acrylate
Colourless / fluorescent
Extended pot life, flexible, humidity curing for shadow zones
Product GE4949
Properties
12,000 Viscosity
Light & Humidity Cured Acrylate
Black
Extended pot life, flexible, humidity curing for shadow zones
Product GE6725
Properties
17,000 Viscosity
Light & heat cured epoxy, Fill for Dam & Fill system
Black
High Tg (184ºC), low CTE (17ppm), very low water absorption, reflow resistant
Product GE6785
Properties
125,000 Viscosity
Light & heat cured epoxy, Dam for Dam & Fill system
Black
High Tg (184ºC), low CTE (17ppm), very low water absorption, reflow resistant
Product GE7065
Properties
55,000 Viscosity
GlobTop for IC Encapsulation, light-fixable (optional) and heat-cured
Black
High Tg (218ºC), low CTE (19ppm), wide operating temperature range (-65ºC – 220ºC)
DELO DUALBOND IC Isotropic Conductive Products
- Isotropic electrically conductive
- Used for: Advanced packaging, medical electronics, automotive sensors, etc.
- Fast light fixation for short cycle times
- Optimized flow behavior
- Mechanics adjustable from tension-compensating to high-strength
Product IC343
Properties
42,000 Viscosity
Light & Heat Cured Electrically Conductive mCD Epoxy
Silver grey
Low temperature (80C°) heat curing for shadow zones, meets ISO 10993-5 for cytotoxity
DELO DUALBOND SJ Structural Joining Products
- Optimized for structural bonding (Structural Joining)
- Used for: E-motors, etc.
- Fast light fixation for short cycle times
- Robust, universal adhesion
- High temperature and chemical resistance
Product SJ2718
Properties
24,000 Viscosity
Light & Heat Cured Epoxy
Beige / opaque
Extended pot life, heat cured for shadow zones, ideal for bonding plastics
Product SJ4717
Properties
46,000 Viscosity
Light and / or Heat Cured Epoxy
Red / transparent
Highly flexible, bonds to a wide range of materials
Product SJ4757
Properties
20,000 Viscosity
Light and / or Heat Cured Epoxy
Black / opaque
Flexible, bonds to a wide range of materials
Product SJ4758
Properties
20,000 Viscosity
Light and / or Heat Cured Epoxy
Colourless / transparent
Highly flexible, bonds to a wide range of materials
Product SJ4768
Properties
10,000 Viscosity
Light and / or Heat Cured Epoxy
Red / fluorescent
Extended pot life, highly flexible, bonds to a wide range of materials
Product SJ4774
Properties
18,000 Viscosity
Light and / or Heat Cured Epoxy
Red / fluorescent
Extended pot life, highly flexible, bonds to a wide range of materials
Product SJ4927
Properties
50,000 Viscosity
Light & Humidity Cured Acrylate
Black / translucent
Extended pot life, flexible, bonds to a wide range of materials
DELO DUALBOND Miscellaneous Products
- General purpose adhesives
- B-stage products for MEMS applications
- Acrylate-based Dam & µDam materials
- Bonding of optical components
Product AD345
Properties
36,000 Viscosity
Light & Heat Cured Epoxy
Beige / opaque
Bonds to a wide range of materials
Product AD761
Properties
5,750 Viscosity
Light and / or Heat Cured Epoxy
Yellowish / transparent
Bonds to a wide range of materials
Product AD4930
Properties
14,000 Viscosity
Light & Humidity Cured Acrylate
Yellowish
Long pot life, meets ISO 10993-5 for cytotoxity
Product AD4950
Properties
26,000 Viscosity
Light & Humidity Cured Acrylate
Colourless
Long pot life, highly flexible, meets ANSI/UL 94 HB flame test
Product BS3770
Properties
115,000 Viscosity
Light & Heat Cured Epoxy
Beige / opaque
B-Stage adhesive, for MEMS die attach and lid seal, very low CTE of -57ºC
Product EG4797
Properties
250,000 Viscosity
Light and / or Heat Cured Acrylate
Black / opaque
µDam for Dam & Fill system
Product EG6290
Properties
150,000 Viscosity
Light and / or Heat Cured Epoxy
Black / fluorescent
Excellent bond strength to ceramic, reflow resistant
Product OM6226
Properties
1,400 Viscosity
Light and / or Heat Cured Epoxy
Colourless / transparent
For stacking / bonding of optical components
Product RE3440
Properties
16,000 Viscosity
Light & Heat Cured Epoxy
Black / opaque
Bonds to a wide range of materials, especially Polycarbonate, meets ISO 10993-5 for cytotoxity
Product SL4955
Properties
35,000 Viscosity
Light and / or Heat Cured Acrylate
Colourless / transparent
Dam for Dam & Fill system, very low Tg (-58ºC)
Knowledge Base Articles
Description
Description
Dual Cured Adhesives (IKB-012)
Link
Description
Lamps for Curing UV Adhesives (IKB-074)
Link
Description
How to Choose the Right Adhesive (IKB-035)
Link
Description
All Things Considered (IKB-042)
Link
Description
Adhesives for PCBs (IKB-040)
Link
Description
Adhesives for Die Attach (IKB-071)
Link
Description
Die Attach Process: Guidance and Setup (IKB-072)
Link
Related Products
FAQs
How does the two-stage curing process work in practice?
During assembly, the dispensed DELO DUALBOND adhesive is exposed to UV or visible light, which fixes the components in position within seconds. The assembly then moves off the line to a batch oven or humidity chamber, where the secondary cure completes polymerisation across the full bond area including any shadow zones. The two stages can be separated by minutes or hours depending on the production process, giving considerable flexibility in line layout and throughput planning.
What is the difference between DELO DUALBOND and DELO KATIOBOND for shadow zone applications?
DELO DUALBOND achieves full polymerisation in shadow zones through a secondary heat or humidity cure after initial light fixation. DELO KATIOBOND achieves shadow cure through cationic chemistry alone, with the acid catalyst continuing to drive polymerisation at room temperature after the light source is removed, without any secondary cure step. DELO DUALBOND is the better fit where a secondary oven or humidity cure is already part of the production process. DELO KATIOBOND suits applications where no secondary cure step is available.
What is the difference between DELO DUALBOND and DELO PHOTOBOND?
DELO PHOTOBOND adhesives cure fully through UV or visible light exposure alone and are best suited to applications with full light access to the bond area, including glass bonding, optical assembly, and medical device manufacturing. DELO DUALBOND adds a secondary heat or humidity cure for applications where shadow zones, enclosed geometries, or complex 3D assemblies make a single light cure insufficient.
Does DELO DUALBOND come in both epoxy and acrylate formulations?
Yes. The DUALBOND range includes both epoxy-based and acrylate-based formulations. Epoxy grades offer higher temperature resistance and chemical resistance for demanding industrial and automotive applications. Acrylate grades offer optical clarity and higher flexibility, covering display assembly and other applications where transparency through the bond line is a requirement.
What secondary cure mechanisms are available in the DELO DUALBOND range?
DELO DUALBOND grades are available with either heat cure or humidity cure as the secondary mechanism. Heat cure grades are processed through a batch oven at defined temperatures and dwell times, suited to high-volume automated lines with oven capacity. Humidity cure grades polymerise at room temperature in the presence of atmospheric moisture, suited to applications where oven processing is not practical or available.
Can I get samples or technical support from Inseto?
Inseto provides technical support, product documentation, and samples for the full DELO DUALBOND range. As the exclusive UK and Ireland DELO distributor, Inseto can advise on grade selection, secondary cure process parameters, and compatible dispensing and curing equipment for your specific application. Send an enquiry using the form below or call us on +44 (0)1264 334505.
Further Information
Applications
Bonding, Sealing, Encapsulation in Shadow Zones or where a quick initial handling strength is required; High-Accuracy Component Placement; Automotive Camera Assembly; Protection Against Chemicals; Temperature-Sensitive Substrates
Industry Segments
Ink Jet Print Heads, Electronics, Microelectronics, Automotive, Mobile Communications, LEDs, Display Bonding & Sealing, Loudspeakers, Plastic & Glass Processing etc.
View more details about DUALBOND on the DELO Website
https://www.delo-adhesives.com/products/adhesives/detail/delo-dualbond/
Region
Available from Inseto in the United Kingdom & Ireland
Request Form
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