Fill-Level Sensor Encapsulation
DELO-GUM silicone adhesives provide a high-purity, one-part solution that ensures long-term reliability and ease of processing.
What do Fill-Level Sensor Encapsulation Adhesives do?
Fill-level sensors used in gas canister monitoring require robust encapsulation to protect sensitive electronics from ingress and environmental stress.
DELO-GUM silicone adhesives are used to encapsulate PCBs in PolyOxyMethylene (POM) plastic housings. These one-part adhesives provide good adhesion both to the POM housing and the FR4 within, and also reliably seal the components from the gas being measured. In addition, because there is a neutral cross-linking of the adhesive, there is no potential for corrosion of the electronic components.
DELO’s silicone sealants are easy to dispense from 310ml Eurocartridges, and curing at RT at a rate of 2mm / 24hrs means that there is no need for an additional curing process (such as heat or UV light).
Key Features of DELO-GUM
- Industrial grade silicone adhesives and sealants
- One-part moisture-cured
- Excellent temperature, chemical and aging resistance
- High purity versions ideal for electronic applications
Fill-Level Sensor Encapsulation Adhesives Resources
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Adhesives for Automotive Sensor Technology
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Why DELO-GUM for Sensor Encapsulation?
- One-Part, Moisture-Cured Silicone: Simplifies application and eliminates the need for heat or UV curing.
- Excellent Adhesion: Bonds effectively to both PolyOxyMethylene (POM) plastic housings and FR4 circuit boards.
- Neutral Cross-Linking: Prevents corrosion of sensitive electronic components.
- High Resistance: Withstands temperature extremes, chemical exposure, and ageing.
- Easy Dispensing: Supplied in 310ml Eurocartridges for convenient manual or automated application.
Application Process:
The adhesive is dispensed into the POM housing to encapsulate the PCB. Curing occurs at room temperature at a rate of approximately 2mm per 24 hours, allowing for flexible production scheduling without additional curing equipment.
Performance Benefits:
- Corrosion-Free Sealing: Ideal for gas-sensitive environments.
- No Additional Curing Required: Reduces energy consumption and equipment costs.
- High Purity: Suitable for sensitive electronics and sensor assemblies.
- Flexible Processing: Compatible with both manual and automated workflows.
Recommended Use Cases:
- Fill-level sensors in gas canisters
- PCB encapsulation in harsh environments
- Sealing of electronic modules in automotive and industrial applications
Got a Question About Fill-Level Sensor Encapsulation Adhesives?
Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help.
From selecting the right adhesive to optimising your curing process, we provide technical guidance, documentation, and samples to support your application needs.
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Further Information
Applications
Bonding, Sealing, Encapsulation, Potting, Protection Against Vibration, Securing, Dam & Fill
Industry Segments
Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.
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Available from Inseto in the United Kingdom & Ireland
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