Silicon Wafer Manufacturing
Silicon wafer manufacturing requires precise handling and processing to ensure high yield and minimal damage.
What do Silicon Wafer Manufacturing Adhesives do?
DELO-DUOPOX two-part epoxy adhesives provide a reliable, removable bonding solution for securing silicon ingots to glass substrates during the wafer slicing process.
Cutting individual wafers from silicon ingots is a delicate operation, as the ingot needs to be held in such a way that the silicon is not damaged. This is achieved by using a removable DELO-DUOPOX two-part epoxy to bond the ingot onto a glass substrate.
After the adhesive is cured, the ingot is cut into the individual wafers by an EDM process. The adhesive is then removed by immersing the assembly into a 15% formic acid solution, at 80C, for three minutes. This ensures optimal yields for the wafers.
DELO-DUOPOX Key Features
- Fast curing at room temperature
- Low-high viscosities and gap-fill versions available
- Uniform stress distribution with long-term durability
- Excellent adhesion to similar and dissimilar substrates
Silicon Wafer Manufacturing Adhesives Resources
File
DELO-DOT PN5 Series Microdispensing Valves and Cleaning Station Brochure
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File
DELO-DOT RE Retraction Valve Brochure
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Why DELO-DUOPOX?
- Uniform Stress Distribution: Minimises mechanical stress during cutting, reducing breakage and improving yield
- Secure Bonding: Holds the silicon ingot firmly in place during EDM (electrical discharge machining) slicing.
- Fast Curing: Cures quickly at room temperature, streamlining production.
- Removable: Easily dissolved in a 15% formic acid solution at 80°C for three minutes, leaving no residue and preserving wafer integrity.
- Versatile Viscosity Options: Available in low to high viscosities and gap-filling versions to suit different ingot geometries.
Got a Question About Silicon Wafer Manufacturing Adhesives?
Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help.
From selecting the right adhesive to optimising your curing process, we provide technical guidance, documentation, and samples to support your application needs.
Knowledge Base Articles
Related Products
Further Information
Applications
Bonding, Sealing, Encapsulation, Potting, Protection Against Vibration, Securing, Dam & Fill
Industry Segments
Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.
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Available from Inseto in the United Kingdom & Ireland
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