Bonding Wire & Ribbon, Precision Metal Stampings & Solder Preforms by Coining
Coining is a diverse world-class manufacturer of interconnect solutions for the microelectronics industry. Coining’s product range can be divided into several groups: bonding wire & ribbon in gold, aluminium, silver, copper, etc.; solder preforms and ribbon in all alloy compositions; precision stampings in a wide range of metals, clad to other metals or solder alloys; & package cover lid assemblies.
Coining is a leading provider of quality fine gold, aluminium and alloyed wire, which is sold to a diverse customer and application base, including hybrid, medical and automotive manufacturers. Coining’s special proprietary wire alloys and doping recipes, combined with its extensive wire manufacturing capabilities in the US and Malaysia, make their products the preferred choice for their global customers.
In 2009, Coining acquired Semiconductor Packaging Materials (SPM) and in May 2011, Coining itself was acquired by AMETEK, Inc., a large public corporation with annual revenues in excess of $5.5 billion and headquartered in Berwyn, PA near Philadelphia, USA. Coining is now part of AMETEK’s Precision and Engineered Materials Business Unit within AMETEK Specialty Metal Products.
Coining is qualified to ISO 9002, QS9000 and ISO14001 and serves the following industries:
- Military
- Aerospace
- Automotive
- Telecommunications
- Medical Electronics
- Fibre Optics
- Microelectronics
- Semiconductor Back-end Assembly etc.
Explore the Coining Range of Bonding Wire & Ribbon, Precision Metal Stampings & Solder Preforms
Bonding Wire & Ribbon
Gold wire, fine & heavy aluminium wire, silver, nickel and copper bonding wire, all available in ribbon format.
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Solder Preforms / Ribbon
An extensive range of solder preforms, spheres and ribbons.
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Micro Metal Stampings
An extensive range of micro metal stampings for electronics applications.
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Package Lids / Covers
Cover Assemblies used to hermetically seal electronic packages.
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What are Microelectronic Assembly Materials?
Microelectronic assembly materials are specialist consumables used to fabricate or electrically, mechanically and thermally integrate semiconductor devices and microelectronic components within a package or module. These materials play a critical role in ensuring reliable interconnection, signal integrity, heat dissipation and long term performance in advanced electronic assemblies.
In microelectronics manufacturing, assembly materials are typically used during die attach, wire bonding, ribbon bonding, soldering, package integration and sealing processes, where extremely high precision and material purities are required. The selection of the correct assembly material is essential to achieve consistent yields, mechanical stability and electrical reliability, particularly as device geometries continue to shrink and performance demands increase.
Key characteristics of microelectronics assembly materials include:
- High purity and material integrity: Manufactured to tight purity controls to minimise contamination, support reliable interconnections and ensure long term device performance in demanding microelectronic applications.
- Precision and dimensional accuracy: Produced with exacting tolerances to enable consistent bonding, soldering and assembly at fine geometries required for semiconductor and microelectronics manufacturing.
- Electrical and thermal performance: Designed to deliver stable electrical conductivity and effective heat dissipation, supporting signal integrity, power handling and thermal management within electronic packages.
- Process compatibility and reliability: Engineered for repeatable performance across wire bonding, ribbon bonding, die attach and soldering processes, helping maintain yield, consistency and production efficiency.
Knowledge Base Articles
Description
What is Microelectronics Assembly (IKB-094)
Further Information
Wiki – Microelectronics
Applications
Wire Bonding, Ribbon Bonding, Die Bonding, Material Interconnect, Heat Dissipation, Thermal Interface, Package Construction & Sealing, Attaching, Soldering etc.
Industry Segments
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonic Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices
Coining Website
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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