Solder Preforms & Ribbon
Coining manufactures high quality solder preforms in all shapes and sizes, including gold-based eutectic die attach preforms, e.g. gold tin, gold germanium, gold silicon, etc. Other alloys are also available, which are used to connect electronic circuitry, package electronic circuitry, dissipate heat, or provide an interface for an electronic connection. They can also produce clad solder metal stampings, ideal for higher volume production applications.
What are Solder Preforms?
Solder preforms are precisely manufactured shapes of solid solder alloy used to create controlled, repeatable joints in microelectronic and semiconductor assemblies. They are designed to deliver an exact volume of solder to a defined location, supporting consistent bondline thickness and reliable electrical and mechanical performance.
During assembly, solder preforms are placed at the joint interface and reflowed under controlled temperature and atmosphere conditions, allowing the molten solder to wet the mating surfaces and form a uniform, low‑void bond.
Solder preforms are widely used in applications such as die attach, package sealing, thermal interfaces, and high‑reliability interconnects where process control and repeatability are critical.
Key Features of Solder Preforms & Ribbon
- Complete range of lead-free alloys
- Au-based for eutectic processing (AuSn, AuGe & AuSi)
- More than 15,000 tools available, all made in-house
- Shapes include squares, rectangles, discs, washers, frames & complex custom shapes
- Thicknesses as small as 12.5µm (0.0005″) (alloy dependent)
Solder Preforms & Ribbon Resources
Solder Preform Brochure
Solder Wire Data Sheet
Coining Gold Washer Brochure
White Paper on AuSn Soldering in Electronic Packaging
Coining Company Brochure
Unlimited Fabrication Possibilities
Coining’s preform fabrication capability is limited only by the physical constraints of the material that is being made. Essentially, if a shape is possible, Coining can make it, quickly, precisely and efficiently.
With their own in-house tooling department, precision stamping tools can be designed and built to customers exact specifications. Progressive dies are used to create a variety of three dimensional configurations, where more complex preform shapes are required.
Coining also has the capability to clad solder to metal, ideal for volume production where each placement of a component takes time (and therefore adds cost).
Key Characteristics of Solder Preforms
- Manufactured to tight dimensional tolerances to deliver precise and repeatable solder volumes at the joint interface
- Available in a wide range of alloys, shapes, and thicknesses to suit different joining, sealing, and thermal requirements
- Reflowed during assembly to form consistent, low‑void solder joints with good wetting and bond integrity
- Commonly used in microelectronic packaging, semiconductor assembly, RF and microwave devices, photonics, and other high‑reliability applications
Solder Preforms: Precision Bonding for High-Reliability Applications
Coining offers one of the industry’s most comprehensive selections of preforms:
- Alloy Range: Gold eutectic (e.g. AuSn, AuGe), Indium, Bismuth, Tin/Lead, and Lead-Free alloys.
- Shapes & Sizes: Rectangles, washers, discs, frames, and custom geometries
- Available in thicknesses as low as 12.5µm (0.0005″).
- Packaging Options: Tape-on-Reel, waffle pack, or bulk
- Prepared in ISO Class 10,000 cleanroom environments for contamination-free handling
- Pure gold washers for use in pacemakers, neurostimulators and cochlear implants
These solder preforms are ideal for die attach, substrate bonding, thermal interface management, and hermetic sealing in high-reliability environments.
Solder Ribbon: Flexible, High-Purity Interconnects
For R&D prototype volumes, Coining supplies solder ribbon to the required width and thickness so that the customer can cut the ribbon into the various shapes that may be required in the early stages of a program, when exact die / component sizes may be unknown. This allows for cost-effective R&D, followed by building a tool to the correct size once production is about to commence. Coining’s solder ribbons are engineered for:
- Alloy Options: Gold, Indium, Tin/Lead, Lead-Free, and custom blends.
- Applications: Reflow soldering, hot bar bonding, laser soldering, and thermal compression bonding.
- Benefits: Uniform thickness, excellent wetting characteristics, and high purity for consistent bond quality.
Solder ribbon is widely used in high-reliability applications, including RF and microwave packaging, photonics, power semiconductor assembly and aerospace devices.
Got a Question About Solder Preforms & Ribbon?
Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help.
From selecting the right solder preforms and ribbon to optimising your processes, we provide technical guidance, documentation, and samples to support your application needs.
Knowledge Base Articles
Related Products
Further Information
Wiki – Integrated Circuit Packaging
Applications
Die Bonding, Material Interconnect, Heat Dissipation, Thermal Interface, Package Construction & Sealing, Attaching, Soldering etc.
Industry Segments
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices
Coining Website
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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