Odd-Form Component Fixing
DELO adhesives for high-vibration environments like motors, aerospace systems, and automotive electronics.
What do Odd-Form Component Fixing Adhesives do?
Odd-form components, such as tall or irregularly shaped parts, often require additional mechanical reinforcement after solder reflow. DELO offers two adhesive technologies tailored for this purpose: two-part epoxies and light-cured adhesives.
Key Features of DELO-DUOPOX
- Two-part cost-effective epoxy adhesives
- Available in 50ml or 200ml DELO Side-by-Side cartridges for ease of use
- Epoxy base ensures dry surface after cure
- Excellent chemical resistance
- Curing can be accelerated by heat
Key Features of DELO KATIOBOND
- Light-activated versions can be used in opaque applications
- Very fast curing to minimise process costs
- Epoxy base ensures dry surface after cure
- Excellent chemical resistance
- One-part, ideal for manual or automated processing
Odd-Form Component Fixing Adhesives Resources
File
DELO-DOT PN5 Series Microdispensing Valves and Cleaning Station Brochure
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File
DELO-DOT RE Retraction Valve Brochure
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File
DELOLUX 20 Series Area Curing Lamps Brochure
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Some demanding applications require these components to be bonded to the PCB after solder reflow, there are two means of doing this with DELO’s adhesives:
The most cost-effective method from a materials perspective is to use a two-part, cold-cured DELO-DUOPOX adhesive. Application is simple as the adhesive is supplied in 50ml or 200ml DELO Side-by-Side cartridges – just attach the mixing nozzle and use a dispense gun to apply the adhesive around the edges of the relevant components. Due to the nature of the adhesive, it can take some hours to achieve sufficient handling strength to move the device onto the next stage of production, but this can be reduced by applying heat.
The second method is to use a light-cured DELO KATIOBOND adhesive. Again, the adhesive is dispensed around the edges of the relevant components, and it is then cured very quickly by means of a high-intensity light source. The high speed of the curing process means that additional manufacturing time is limited, thereby keeping processing costs to a minimum.
Use cases
- Post-reflow reinforcement of tall components
- High-vibration assemblies in:
- Automotive electronics
- Aerospace systems
- Industrial control units
- Power electronics
Industry segments
- PCB Assembly
- Microelectronic / Hybrid Assembly
- Fibre Optics & Photonics
- Smart Cards & RFID
- OEM Equipment Manufacturing
Got a Question About Odd-Form Component Fixing Adhesives?
Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help.
From selecting the right adhesive to optimising your curing process, we provide technical guidance, documentation, and samples to support your application needs.
Knowledge Base Articles
Related Products
Further Information
Applications
Bonding, Sealing, Encapsulation, Potting, Protection Against Vibration, Securing, Dam & Fill
Industry Segments
Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.
Delo Website
Region
Available from Inseto in the United Kingdom & Ireland
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