Dam & Fill Encapsulation Adhesives
Dam & Fill adhesives have a low CTE to minimise the stress placed on the wire bonds, and can withstand operating temperatures from -65°C to +180°C (product dependant).
What do Dam & Fill Encapsulation Adhesives do?
The Dam & Fill process consists of building a wall, or Dam, around the area to be encapsulated (generally this is larger than 2mm x 2mm), using a high-viscosity adhesive that does not slump between dispensing and curing. The cavity created by the Dam is then Filled with a low-viscosity version of the same adhesive.
The Dam & Fill are then cured simultaneously either by heat (45 minutes cure time at 90°C, or 15 minutes at 130°C), or by light (30s cure time, depending on the intensity of the UV lamp).
More detailed information on DELO’s range of encapsulation adhesives can be found here.
Adhesive Key Features
- High purity adhesives for encapsulating bare die
- Low CTE to prevent substrate warpage and breaking of wirebonds
- High Tg to minimise stresses, both during and after cure
- Excellent protection against mechanical stresses (temperature, vibration, etc.)
- Very high chemical resistance, e.g. automotive fluids, printing inks, etc.
Excellent chemical resistance
In addition to protecting the die, they also provide excellent chemical resistance, and are high purity adhesives to reduce outgassing. Ideally, in high reliability applications, the adhesives will have a high glass transition (Tg) temperature in excess of 175°C to minimise the stress on the die during temperature cycling / shock.
Got a Question About Dam & Fill Encapsulation Adhesives?
Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help.
From selecting the right adhesive to optimising your curing process, we provide technical guidance, documentation, and samples to support your application needs.
Knowledge Base Articles
Related Products
Further Information
Applications
Bonding, Sealing, Encapsulation, Potting, Protection Against Vibration, Securing, Dam & Fill
Industry Segments
Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.
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Region
Available from Inseto in the United Kingdom & Ireland
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