Adhesives for Die Attach

Inseto supplies a range of non-conductive epoxies for various die attach applications found in microelectronic and related semiconductor applications. Non-conductive epoxies are used where the device requires no electrical transmission through the back of the die. Electrically conductive materials, also known as isotropic adhesives, are used where the device requires an electrical transmission through the back of the die.

Thermally conductive die attach adhesives transmit heat but are electrically insulating.

The choice of adhesive is usually dictated by the IC designer, especially regarding electrical conductivity. However, for cost reasons, electrically conductive adhesives are only chosen where absolutely necessary, as they are significantly more expensive that non-conductive adhesives. A need for thermal conductivity often doesn’t become apparent until the first prototype parts are assembled and tested.

Non-Conductive Die Attach Adhesives

DELO DUALBOND AD761 – a fast-curing epoxy (3 minutes at 150°C) with excellent compliance for larger die applications. Can be light-fixed in seconds for high-placement accuracy. Very long pot life of 28 days.

DELO DUALBOND BS3770 – a B-Staged epoxy. Designed for MEMS die attach, but also suitable for lid attach. A-stage cured in 10 seconds using UV light, then B-Staged in the oven for 40 minutes at 150°C. Suitable for a flexible manufacturing process.

DELO MONOPOX DA255 – an unfilled epoxy ideal for fast-curing applications: 2 minutes at 150°C (or thermode cure in 6 seconds at 180°C). Very high die shear strength of 210 Newtons.

DELO MONOPOX DA587 – an unfilled epoxy ideal for fast-curing applications: 2 minutes at 150C. Longer than usual pot life of 5 days. Very high die shear strength of 180 Newtons.

DELO DUALBOND LT354 – an unfilled epoxy suitable for temperature-sensitive substrates (curing at 80°C in 30 minutes). Can be light-fixed in seconds for high-placement accuracy.

DELO DUALBOND OB749 – a filled epoxy with independent heat-curing (60 minutes at 80°C) and light-curing (2 – 6 seconds at 1,000 mW/cm²) mechanisms. Complies with NASA (ASTM E 595-93) outgassing requirements.

DELO DUALBOND OB786 – a filled epoxy with independent heat-curing (50 minutes at 80°C) and light-curing (3 – 10 seconds at 1,000 mW/cm²) mechanisms. Very high Tg of 179°C.

DELO DUALBOND OB787 – a high viscosity filled epoxy with independent heat-curing (60 minutes at 80°C) and light-curing (2 – 6 seconds at 1,000 mW/cm²) mechanisms. Very high Tg of 185°C.

DELO DUALBOND OB793 – a high viscosity filled epoxy with independent heat-curing (60 minutes at 80°C) and light-curing (5 – 10 seconds at 1,000 mW/cm²) mechanisms.

DELO DUALBOND OB6769 – a high viscosity filled epoxy with independent heat-curing (50 minutes at 80°C) and light-curing (1 – 3 seconds at 1,000 mW/cm²) mechanisms. Complies with NASA (ASTM E 595-93) outgassing requirements.

Conductive Die Attach Adhesives

DELO DUALBOND IC343 – a silver-filled epoxy that has an optional UV-curing capability; a 1 – 5 second UV tack-in-place followed by 30 minutes at 80°C; ideal for high-accuracy placement requirements; extremely low outgassing, meeting international HDD (Hard Disk Drive) requirements (>> ESA / NASA).

Thermally Conductive, Electrically Insulating Die Attach Adhesives

DELO MONOPOX TC2270 – filled with aluminium nitride for enhanced thermal conductivity (1.7W / m*K). Very low temperature curing (90 minutes at 60°C). Meets JEDEC MSL1 requirements. Works even at Cryogenic temperatures (4°K).

Anisotropic Conductive Adhesives

All anisotropic (Z-axis) adhesives require both heat and pressure (usually from a thermode or on the die bonder, with the collet holding the die in place) in order to achieve electrical conductivity in the Z-axis. A typical pressure is 1 – 2 Newtons / mm², based on a 1mm-square die.

DELO MONOPOX AC268 – filled with nickel particles, typical size of 5µm. Cures in 6 seconds at 190°C. DELO MONOPOX AC6530 – filled with nickel particles, typical size of 5µm. Cures in 1 second at 230°C.

Author Biography

Eamonn Redmond is a Senior Technical Sales Engineer at Inseto (UK) Ltd, leading the Materials and Adhesives divisions. With nearly four decades of experience in microelectronics, he combines strong technical knowledge with practical commercial insight.

After completing a B.Eng. in Electronics at the University of Limerick, Eamonn began his career at Analog Devices, working as an In‑Line Test Engineer and Process Engineer. During this time, he developed hands‑on expertise in die attach, wire bonding and environmental testing, including burn‑in, temperature cycling and thermal shock. He later progressed to IC Production Manager, gaining experience in wafer‑level and package‑level testing and modern semiconductor production operations.

In the early 1990s, Eamonn moved into technical sales, specialising in die attach adhesives, eutectic solders and materials for wire and ribbon bonding. This role established a strong foundation in adhesive technologies for high‑reliability microelectronic applications.

Since joining Inseto in 1996, Eamonn has supported customers with a wide range of microelectronic materials, including die attach adhesives and encapsulation compounds, alongside substrate materials such as thick‑film inks and thin‑film substrates. He is widely regarded as a key technical resource for customers seeking reliable bonding and encapsulation solutions.