Thermal Dissipation Materials by Santier
Santier, Inc., is a center of excellence for the engineering and manufacture of high thermal conductivity, controlled expansion metal matrix composites for thermal dissipation in microelectronic housings and assemblies, specialising in copper tungsten (CuW) and copper molybdenum (CuMo).
Other thermal dissipation materials include Super CMC (S-CuMoCu) and copper graphite (Cu-Gr). Fully vertical manufacturing also provides assembly and plating, integrating the custom thermal management materials into hermetic IC packaging and microelectronic housings. Product applications include aerospace, defense, medical, telecoms and communications, plus many other industries around the world.
As the world leader in the manufacture of CuW, CuMo, and other metal matrix composites for thermal management applications i.e. high power semiconductor heatsinks etc., Santier utilises state-of-the-art powder metal technology. Santier maintains uncompromising dedication to continuous improvement in its engineered materials. Constantly-monitored criteria include composition, analysis of trace elements, particle distribution, grain size, tap density and flow characteristics.
Santier is certified to ISO 9001:2015 and AS9100D.
Explore the Santier Range of Thermal Dissipation Materials
What are Thermal Dissipation Materials?
Thermal dissipation materials are engineered materials used to remove and control heat generated by microelectronic and semiconductor devices during operation. They form a critical thermal path between the heat‑generating component and the surrounding structure, helping to maintain stable operating temperatures and long‑term reliability.
In microelectronics, these materials are commonly used as heat spreaders, sub‑mounts, carriers, and package components, particularly where high power density and controlled thermal expansion are required.
Key characteristics of thermal dissipation materials include:
- Designed to efficiently transfer heat away from active devices, reducing thermal stress and preventing performance degradation
- Engineered with controlled coefficients of thermal expansion to minimise stress between dissimilar materials
- Available in metal and composite material systems suitable for high‑power and high‑reliability applications
- Commonly used in microelectronic packaging, power semiconductor assemblies, RF and microwave devices, and photonic systems
Knowledge Base Articles
Description
Die Attach Process: Guidance & Setup (IKB-072)
Further Information
Wiki – Thermal Management
Applications
Die Bonding Sub-Mounts, Heat Dissipation / Heatsinks, Thermal Interface, Microwave Carriers, LDMOS, Power and Bi-Polar RF Transistor Packages, Laser Diode Substrates, Mounts and Blocks, RF Transistor Flanges and Bases, Seal Frames, Hermetic Packages & Enclosures, High Speed Digital Packages
Industry Segments
Wireless, Internet Infrastructure, Military, Aerospace, Industrial, Telecommunications, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly etc.
Santier Website
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
Request Form
Back to top