Adhesives for Microelectronic Assembly
DELO adhesives are used in a vast range of microelectronic assembly applications including die attach, IC encapsulation including Dam & Fill, plus light-activated and light-cured adhesives for casting, sealing and joining.
As well as traditional die attach adhesives such as conductive & non-conductive epoxies, DELO has developed a dual-curing silver epoxy that cures by a combination of UV & heat, or just by heat alone. UV-curing the fillet around the die immediately after component placement guarantees that movement of the die during heat cure in eliminated. This results in improved placement accuracy at repeatable levels. It can also enable off-line heat curing, thereby saving costly in-line processing time.
For further information on the full range of die attach adhesives or encapsulation “Glob-Top” adhesives, click on the product links below.
View more detailed application examples of “Adhesives for Microelectronic Assembly“, including materials for MEMS applications and for large or small die encapsulation. However if your particular requirement is not listed, please contact us for further information, as it is more than likely that a similar requirement has been solved before.
Explore the DELO Range of Adhesives for Microelectronic Assembly
Die Attach Adhesives
Delo’s high-purity, low CTE die attach adhesives, including conductive and non-conductive materials.
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Encapsulation Adhesives
Glob-top adhesives for protecting bare silicon die. Adhesives for small area protection, plus dam and fill versions for larger die.
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DELO
See the DELO product range for all applications.
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What are Microelectronic Adhesives?
Microelectronic adhesives are high‑purity, precision‑engineered bonding materials used in the assembly and packaging of microelectronic and semiconductor devices. They are designed to securely bond, protect, and electrically or thermally manage components such as semiconductor dies, integrated circuits, sensors, and other miniature electronic elements within miniature assemblies.
Unlike general industrial adhesives, microelectronic adhesives are formulated to meet the demanding requirements of electronic manufacturing, including low ionic contamination, controlled mechanical stress, high dimensional stability, and compatibility with fine pitch and miniaturised structures. These materials are widely used where traditional mechanical fixing or soldering is impractical or where stress reduction and reliability are critical.
Key characteristics of microelectronic adhesives include:
- High‑purity, low‑ionic formulations designed for use in microelectronic assembly
- Engineered to provide mechanical bonding, with or without electrical conductivity
- Used for die attach, flip‑chip bonding, glob‑top encapsulation, and dam‑and‑fill
- Available with a range of curing mechanisms, including heat‑cure, light‑cure, and dual‑cure
For information on adhesives for microelectronic assembly, please refer to our Knowledge Base fact sheet: Die Attach Process: Guidance & Setup.
Knowledge Base Articles
Description
Setting up the Die Attach Process (IKB-072)
Further Information
Wiki – Integrated Circuit Packaging
Applications
Bonding, Glob-Top, Encapsulation, Z-Axis Bonding, Sealing, Potting, Protection Against Vibration, Conductive Electrical Connection, Dam & Fill
Industry Segments
Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics, Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.
DELO Website
Region
Available from Inseto in the United Kingdom & Ireland
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