Wire Bond Wedge Tool and Die Bond Tooling by MPP
MPP is a world leading wire bond wedge tool and die bond tool manufacturer, producing an extensive range of bonding wedges and die attach tooling. Incorporating the former Kulicke and Soffa Microswiss technology, with more than 25 years experience in supplying tooling to the Semiconductor assembly industry, MPP range of bond tools are sold worldwide.
The MPP range of products includes wire bonding tools for fine wire ultrasonic wedge bonding, including Aluminum (Al), Gold (Au), and Copper (Cu) wire bond applications. In addition, MPP also manufacture and develop an extensive range of ultrasonic bonding wedges for RF ribbon bonding applications using Au and Al ribbons.
The range of die bond tools, includes die attach collets, pickup tips, eject needles and epoxy stamping tools, with customs tooling also available on request.
The MPP products are designed to suit all major brands of manual and automatic wire bonding, die bonding equipment, including: K&S, Orthodyne, BESI – Datacon, ASM, Amicra, Delvotec, Palomar, MRSI, Hesse Mechatronics, F&S Bondtec, TPT, Hybond, Westbond, etc.
Explore the MPP Range of Wire Bond Wedge Tool and Die Bond Tooling
What Are Wedge and Die Bond Tools Used For?
Wedge and die bond tools are critical components used in the assembly of semiconductor devices.
Die bond tooling is used to accurately pick and place semiconductor dies onto leadframes, substrates, or package bases. Wedge tools are used in the subsequent wire bonding process, which creates the electrical connections between a semiconductor die and its package.
Both tool types enable high precision interconnection, consistent production quality and ensure long term device reliability, across a wide range of microelectronic applications.
Key characteristics of wedge and die bond tools include:
- Precision and accuracy with the tools engineered to extremely tight tolerances.
- Material compatibility for consistent bond quality and reduced tool wear.
- Thermal and mechanical stability maintaining dimensional accuracy during use.
- Reliability and repeatability for consistent performance from tool to tool.
Knowledge Base Articles
Description
What is Microelectronics Assembly? (IKB-094)
Further Information
Wiki – Integrated Circuit Packaging
Applications
Wedge Wire Bonding, Ribbon Bonding, Die Bonding, Tab Bonding, Eutectic Die Attach, Die Sorting
Industry Segments
Semiconductor Production, Microelectronic Assembly, Power Semiconductor Assembly, Semiconductor Back-end Assembly, University Research etc.
MPP Website
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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