Aluminium Bonding Ribbon
Coining produces aluminium ribbon for high power applications. These ribbons are typically custom-manufactured to exacting specifications, producing unparalleled uniformity of width and thereby minimising snagging in the bonding wedge, resulting in significant reductions of machine downtime.
What is Aluminium Bonding Ribbon?
Aluminium bonding ribbon is a flat, high‑purity aluminium interconnect used in semiconductor and microelectronic assembly, primarily for high‑power and high‑current applications. It performs the same fundamental function as aluminium bonding wire, creating electrical and mechanical connections between a semiconductor die and a substrate or lead frame, but its rectangular geometry delivers important advantages in power handling, thermal performance, and assembly efficiency.
Aluminium bonding ribbon is most commonly applied using ultrasonic wedge bonding and is widely used in power semiconductor modules, automotive electronics, and industrial devices.
Key Features of Aluminium Bonding Ribbon
- High-purity aluminium for high power applications
- Custom-manufactured to exacting specifications
- Very tight dimensional tolerances of ±3%
- Fewer connections required than wire results in reduced process time
Aluminium Bonding Ribbon Resources
Coining Aluminium Ribbon Data Sheet
Design Considerations for Aluminium Ribbon
Coining Company Brochure
Advantage of Aluminium Ribbon over Aluminium Wire
In high power applications that traditionally used aluminium wire, the advantage of switching to aluminium ribbon results in increased cycle times by reducing process times, achieved by eliminating the need for multiple wire bonds in devices. For example, 8 wire bonds of 125µm diameter can be replaced by 1 ribbon bond of 1mm x 100µm. Reducing the number of bonds also increases the reliability of the end product.
Key Characteristics of Aluminium Bonding Ribbon
- The wide, flat cross‑section of aluminium bonding ribbon enables it to carry significantly higher currents than individual round wires.
- Aluminium bonding ribbon provides an increased surface area for heat dissipation compared with round wire.
- By replacing multiple wire bonds with a single ribbon bond, aluminium bonding ribbon reduces the total number of bond interfaces within a device.
- Manufactured from high‑purity aluminium, bonding ribbon forms reliable metallurgical bonds to aluminium pads and substrates.
Got a Question About Aluminium Bonding Ribbon?
Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help.
From selecting the right bonding ribbon to optimising your processes, we provide technical guidance, documentation, samples and on-site training to support your application needs.
Knowledge Base Articles
Description
Wire Bonding Battery Connections (IKB-069)
Bond Wire Handling Considerations (IKB-023)
Understanding Wire Pull Testing (IKB-003)
Explanation of Low Pressure Plasma Cleaning (IKB-014)
Solder Die Attach For High Power Applications (IKB-016)
How IR Induction Furnaces Work (IKB-024)
What is Wire Bonding (IKB-015)
Related Products
Further Information
Wiki – Wire Bonding Overview
Applications
Wire Bonding, Ribbon Bonding, Battery Assembly, Material Interconnect, etc.
Industry Segments
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices
Coining Website
https://www.ametek-coining.com/products/metal-bonding-wire-and-ribbon/aluminum-ribbon
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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