Semiconductor Sintering Materials
Revolutionising Semiconductor Assembly with Inventec’s Semiconductor Sintering Materials (IKB-091).
As the demand for faster, smaller, and more energy-efficient electronics continues to grow, the materials used in semiconductor packaging are undergoing a quiet revolution. One of the most exciting developments in this space is the rise of semiconductor sintering materials—and Inventec Performance Chemicals is leading the charge with its innovative ECOREL™ SINTEC product line.
Why Semiconductor Sintering?
Traditional soldering methods, while reliable, are increasingly challenged by the thermal and mechanical demands of modern electronics. Semiconductor sintering offers a compelling alternative: it creates solid-state bonds using metal particles, typically silver or copper, without melting the material. The result? Joints that are stronger, more conductive, and better suited for high-temperature environments.
Meet ECOREL™ SINTEC
Inventec’s ECOREL™ SINTEC sintering pastes are designed specifically for semiconductor sintering, including die attach, component bonding, and substrate attach. These materials are engineered to meet the rigorous demands of power electronics, automotive systems, and high-frequency devices.
- High Thermal Conductivity: Over 300 W/m·K, ideal for heat-intensive applications.
- High Shear Strength: >50 MPa, ensuring long-term mechanical reliability.
- Room Temperature Storage: 6-month shelf life, simplifying logistics.
- Environmentally Friendly: Lead-free, halogen-free, and free of nanoparticles.
One of the standout innovations from Inventec is the single-step sintering process. With ECOREL™ SINTEC, manufacturers can simultaneously bond dies and substrates, reducing energy consumption, process time, and material waste. This streamlined approach is especially valuable in high-volume production environments.
Applications That Matter
Inventec’s semiconductor sintering materials are already making an impact in:
- Power modules for electric vehicles and renewable energy
- RF and microwave devices for telecommunications
- LEDs and optoelectronics requiring precise thermal control
- SiC and GaN-based systems operating at high voltages and temperatures
Looking Ahead
As electronics continue to evolve, the materials behind them must keep pace. Inventec’s commitment to innovation, sustainability, and performance positions its sintering solutions as a cornerstone of next-generation semiconductor packaging.
Whether you’re designing for harsh environments or pushing the limits of miniaturisation, Inventec’s ECOREL™ SINTEC semiconductor sintering materials offer a future-ready foundation for your assembly needs.
Author
Date
Version
Author
Matt Brown
Date
02 July 2025
Version
IKB091 Rev. 1
Author Biography
Matt Brown is the Managing Director of Inseto, a specialist supplier of materials, equipment and process expertise to the semiconductor, microelectronics and advanced manufacturing industries. He was appointed Managing Director in 2020 and is a shareholder in the business. .
Matt brings more than 30 years’ experience in technical sales and distribution serving the semiconductor and related high technology industries. His career has focused on supporting customers with complex manufacturing requirements, where material selection, process reliability and long term supplier relationships are critical to success.
In addition to his role at Inseto, Matt is a Trustee of IMAPS‑UK, reflecting his ongoing involvement in the microelectronics community and commitment to supporting knowledge sharing and professional development within the industry.
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