Fully Automatic Dicing Saws
ADT manufacture two series of fully automatic dicing saw, including the 7022 single spindle system and 8020 twin spindle system, which offers increased throughput and reduced cost of ownership.
Both systems are available with standard power spindles for dicing silicon or similar materials and in higher power versions for thicker or harder materials.
Fully Automatic Dicing Systems 7220 Series
The 7220 Single Spindle Series for advanced automated dicing of wafers and hard materials.
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Fully Automatic Dicing Systems 8020 Series
The 8020 Series feature twin facing spindles that can simultaneously dice wafers at high throughput.
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Fully Automatic 300mm Dicing System 8030
The 8030 systems offers twin facing spindles capable of fully automatic dicing up to 300mm diameter wafers or 300mm x 300mm panels.
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ADT – Advanced Dicing Technologies
See the full ADT Dicing Equipment product range
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Further Information
What is a Fully Automatic Wafer Dicing Saw?
A fully automatic wafer dicing saw is an advanced precision cutting system used in semiconductor manufacturing to separate patterned wafers into individual chips (dies) before packaging. Unlike semiautomatic systems, fully automatic saws eliminate manual intervention by automating wafer loading, alignment, cutting, and unloading. This ensures maximum throughput, consistent accuracy, and reduced operator dependency
Key Components of a Fully Automatic Wafer Dicing Saw:
- Spindle and Diamond Blade: Precisely rotates the cutting blade at high speeds.
- Automatic Wafer Loader: Handles wafer loading and unloading
- Chuck: Holds the wafer securely during the cutting process.
- X-Y Stage: Moves the wafer under the diamond blade for accurate cutting paths.
- Vision Alignment: Aligns wafer streets with the blade for precision.
- Coolant System: Delivers fluid to cool the blade and reduce contamination.
- Control Interface: Allows operators to set parameters and monitor cutting.
- Safety Enclosure: Protects the operator and maintains a clean cutting environment.
Inseto Knowledge Base Document:
Read our guide to the “Dicing Blade Selection“
Wiki – Die Singulation
Applications
Fully Automatic Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic Components, Cutting Glass & Glass Filters, Dicing MEMS, Package Singulation etc., PCB Assembly Industries, Universities Wafer Processing, Passive Component Manufacturing, Separating Medical Devices.
Industry Segments
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics / Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing.
ADT Website
Region
ADT’s wafer dicing equipment is available from Inseto in the United Kingdom, Ireland & Nordic Region: Denmark, Sweden, Finland and Norway
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