Lithography, Wafer Bonding & Mask Clean-Fabrication Equipment by SUSS
SUSS are the manufacturer of the world’s first mask aligner and recognised technology leader, designer and producer of process equipment for backend lithography, wafer bonding and photomask processing.
SUSS provides cost-effective solutions with unsurpassed quality and cutting-edge technology, enabling their customers to maximise yield at high throughput thus reducing cost of ownership.
In close cooperation with research institutes and industry partners SUSS contributes to the advancement of next-generation technologies such as 3D Integration and Nanoimprint lithography as well as key processes for WLP, MEMS and LED manufacturing. With its global infrastructure for applications and service SUSS supports more than 8,000 installed systems worldwide.
Spin Coaters, Spray Coater & Developer
SUSS spin coaters, developers and spray coaters are renowned for their consistency including bench-top, free-standing to automated tools.
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Ink Jet Printer
The Pixdro range of ink-jet printers for research, development or production printing applications are now part of SUSS.
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Mask Aligners
High-resolution lithography exposure systems providing exceptional reliability & maximum light uniformity.
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Wafer Bonders, De-Bonders & Aligners
Manual to automated permanent and non-permanent wafer bonders & de-bonders, for MEMS, SOI and advanced packaging applications.
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Photomask Equipment
Manual to fully automated mask or wafer cleaning systems and mask fabrication equipment for developing, cleaning, baking, etching etc.
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Further Information
What is Semiconductor Lithography?
Semiconductor lithography is a fundamental microfabrication technique used to create precise patterns at the micron and nanometer scale on substrates such as silicon wafers. This process is essential in the production of integrated circuits and other semiconductor devices. At its core, lithography transfers a design from a photomask or template onto the wafer using a light-sensitive material known as photoresist.
The resulting patterned layer, often applied repeatedly with different designs, serves as a guide for subsequent steps like etching or material deposition, ultimately forming the intricate structures that make up the device.
Key aspects of semiconductor lithography include:
- Substrate Preparation: Cleaning and applying adhesion promoters to ensure photoresists bond properly.
- Photoresist Coating: Applying a uniform thin film of photoresist, often using spin-coating for precision.
- Exposure: Aligning the wafer with a photomask and exposing it to ultraviolet (UV) light, which alters the solubility of the photoresist.
- Development: Removing either the exposed or unexposed regions of photoresist (depending on whether a positive or negative resist is used).
- Pattern Transfer: Using the developed pattern to etch or deposit materials, creating the desired circuit features.
Inseto Knowledge Base Document:
Read our guide to the “Semiconductor Photolithography Basics“
Wiki – Die Singulation
Applications
Wafer and Substrate Lithography, Wafer Coating and Cleaning Processes of MicroFluidic Devices, Power Semiconductors, MEMS Devices, Compound & GaN, Photonic Components etc.
Industry Segments
Semiconductor Wafer Fabrication, University Research and Development
SUSS Website
Region
United Kingdom, Ireland, Sweden, Finland, Norway & Iceland
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