DER‑IC Newcastle Enhances Power Electronic Packaging Capability

Specific Requirements:

As part of its mission to expand the United Kingdom’s capability in power electronics, machines and drives, DER‑IC Newcastle required a highly versatile and precise die bonding platform, with a high-force placement capability. The system also needed to support a wide range of advanced processes used in power semiconductor and microelectronic assembly. These included precision pick and place, adhesive dispensing, UV curing, eutectic and soft solder bonding techniques.

Tresky AG Solution:

Inseto supplied and installed the Tresky T‑5300 semi‑automatic die bonder, designed for high-precision microelectronic assembly and low volume production.

The configuration delivered to DER‑IC included:

• Inert gas reflow and eutectic and soft solder die attach
• Stamping system for epoxy and solder transfer
• Integrated measurement system
• High Force Module for demanding bonding applications
• Automated beam splitter for precision component alignment

This configuration provides a robust and adaptable platform capable of meeting DER‑IC’s immediate technical needs while also supporting future development work.

Outcome:

The Tresky T‑5300 has significantly enhanced DER‑IC’s capability to support both industrial and academic partners by offering a reliable and flexible die bonding resource. Its installation enables:

• High‑accuracy placement for advanced semiconductor and power electronics assemblies
• Improved process capability for research, development and prototype builds
• Consistent, repeatable performance for complex bonding operations
• Increased capacity for collaborative development programmes across industry and academia

The precision engineering and modular design of the T‑5300 ensure that it will remain a key asset in supporting DER‑IC’s role in accelerating UK innovation in power electronics and advanced manufacturing technologies.