G&H Installs Tresky T-5300-W for Advanced Photonic Die Attach

Specific Requirements:

Gooch & Housego (G&H), Torquay, United Kingdom required a highly precise and flexible eutectic die bonding solution to support its cutting-edge photonic production capabilities. One machine replaced two obsolete manual die bonders, which could not meet the specific UPH requirements due to the complex process and high placement accuracy required.

Tresky AG Solution:

Inseto supplied and installed the Tresky T-5300-W die bonder, a semi-automatic system designed for high precision and flexibility both in R&D and production. Key features of the configuration include:

• Automated beam splitter for sub-micron accuracy
• Micron-level XY measurement feature to check placement accuracies
• Wafer die eject system for direct picking, improving cycle times
• UV module for snap curing adhesives
• Tool and substrate heating for eutectic bonding
• Custom package holder for processing multiple device types
• Dedicated second spindle for component or pre-form pick and place
• Precision kit for improved alignment and control

This modular setup ensures G&H can perform a wide range of bonding techniques, including flip-chip, epoxy dispense or stamping, UV curing, die sorting and eutectic bonding, all with Tresky’s True Vertical Technology™, guaranteeing parallelism between chip and substrate at any height.

Outcome:

The installation was completed successfully, and the system is now operational. Early feedback indicates:

• Exceptional placement accuracy for microelectronic components.
• Improved process repeatability, reducing operator-induced variation.
• Versatility to support multiple bonding methods.
• Cycle time has been improved using modern techniques and equipment

Customer Feedback:

At G&H Torquay, the introduction of the Tresky T-5300-W Die Bonder represents a significant step change in our advanced photonic packaging capability.  While replacing legacy equipment, this investment strengthens our position at the forefront of the High-Tech Photonics Industry in the UK and underpins our long-term manufacturing strategy.

Driven by a robust, approved URS, the Tresky T-5300 platform was selected to exceed the performance of the previous EDB-80 system while materially improving precision, process control, throughput, and equipment reliability. The enhanced accuracy and repeatability of the T-5300-W enable’s high-precision die bonding for increasingly complex and miniaturised photonic assemblies, supporting next-generation solutions across Life Sciences, Photonics, Aerospace, and Defence markets.

The upgrade delivers measurable operational benefits, reduced cycle times, improved yields, and a significant reduction in waste, scrap, and non-value-added activity (MUDA). Improved process stability and reduced maintenance intervention further mitigate obsolescence risk and enhance supply continuity for our customers.

With a projected ROI of less than two years, this investment not only transforms our technical capability but also strengthens customer confidence through improved quality, responsiveness, and long-term manufacturing resilience.

Manufacturing Engineering Manager, G&H Torquay