Electroless Wafer Plating Systems

Electroless Wafer Plating Systems Key Features

Maskless electroless deposition of Ni Au, NiPd and NiPdAu
Suitable for aluminium and copper bond pads
Fully automated wet chemical plating line with robotic wafer handling
Integrated in line bath analysis and replenishment
Total Quality Software for recipe management, process control and data logging
Optional SECS GEM interface for factory integration
Supports wafer sizes from 100 mm to 300 mm

The PacTech PACLINE® is a fully automated electroless plating system designed for high reliability wafer level metallisation in advanced semiconductor packaging. It enables maskless deposition of Nickel, Palladium and Gold on aluminium or copper bond pads, providing a robust adhesion, diffusion barrier and wetting layer for downstream assembly processes such as flip chip and WLCSP.

PACLINE® systems are used globally in both production and process development environments, offering reproducible results backed by decades of high volume manufacturing experience.

Process Advantages

The PACLINE® platform uses a self patterning wet chemical plating process, eliminating the need for lithography masks while ensuring uniform, high quality metallisation. The deposited metal layers function as:

Adhesion layers
Diffusion barriers
Wetting layers for solder and wire bonding

This enhances long term reliability and performance across a wide range of advanced packaging applications.

PacTech offers PACLINE® as part of a turnkey process solution, combining equipment, proprietary chemicals and technology transfer to support successful implementation across different production volumes. This approach reduces process risk and accelerates time to production.