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Diameter of the wafer listed in mm. Typically wafers are talked about in inches; typical sizes are 2”,3”,4”,5”,6”,8”& 12” – with 4”,6” and 8” the most commonly used in industry and academia.

This specifies the type of wafer, in the case of all SOS wafers this is SOS – Silicon on Sapphire.

SOS (Silicon on Sapphire). SOS wafers make use of a silicon layer grown on a sapphire substrate and are a specific subset of SOI wafers, where the insulator is sapphire.

This is an additional metric for describing the plane of the lower material (sapphire wafer). For R-plane this is (1102).

The thickness of the wafer affects the mechanical properties and is typically expressed in µm (microns) and with a tolerance (± 20µm), The tolerance is measured through a total thickness variation (TTV).

This refers to the finish on the surface of the glass and can be either SSP or DSP.

Alignment fiducial refers to the flats or notches used to identify the wafer. Originally flats were used to identify TYPE and well as ORIENTATION, but now there is less convention about what the flats mean, and notches are quite common on 8” (200mm) wafers.

Coating thickness, typically µm, nm or Å.

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