Glob Top Encapsulation Adhesives
In addition to protecting the die, these adhesives also provide excellent chemical resistance and are high purity to minimise outgassing.
What do Glob Top Encapsulation Adhesives do?
Glob top protecting of small die is achieved by dispensing an adhesive onto the surface of the die until a dome is formed that covers the die and the wire bonds. It is generally suitable for encapsulation areas < 2mm x 2mm, as the dome becomes too high for larger areas (another process, called Dam & Fill) is used for larger area encapsulation.
The adhesive is cured either by heat (~ 20 minute cure time at 150°C), or by light (< 1 minute cure time, depending on the intensity of the UV lamp). Care needs to be taken during the curing process that the adhesive doesn’t slump, leaving either the bond wire or the die surface exposed.
More detailed information on DELO’s range of encapsulation adhesives can be found here.
Adhesives Key Features
- High purity glob top adhesives for encapsulating bare die
- Epoxy base materials, developed for glob top applications
- Low CTE to prevent substrate warp-age and breaking of wire bonds
- High Tg to minimise stresses, both during and after cure
- Excellent protection against mechanical stresses (temperature, vibration, etc.)
- Very high chemical resistance, e.g. automotive fluids, printing inks, etc.
Light fixed, heat cured
The latest generation of glob tops can be light-fixed in place, thereby allowing greater control over the flow behaviour of the encapsulation. Heat-cure is still mandatory, but this can be achieved off-line, increasing manufacturing flexibility.
Low CTE to minimise stress
Encapsulation adhesives have a low CTE to minimise the stress placed on the wire bonds, and can withstand operating temperatures from -65°C to +180°C (product dependant). In addition, the very high glass transition temperatures in excess of 200°C allows almost all high-reliability applications to operate without the added stress of continuously crossing the Tg threshold.
Got a Question About Glob Top Encapsulation Adhesives?
Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help.
From selecting the right adhesive to optimising your curing process, we provide technical guidance, documentation, and samples to support your application needs.
Knowledge Base Articles
Related Products
Further Information
Applications
Bonding, Sealing, Encapsulation, Potting, Protection Against Vibration, Securing, Dam & Fill
Industry Segments
Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.
Delo Website
Region
Available from Inseto in the United Kingdom & Ireland
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