Conductive Die Attach Adhesives
DELO’s die attach adhesives have an extended working life, simplifying handling and processing, plus they meet an extensive range of customer requirements and specifications.
What do Conductive Die Attach Adhesives do?
DELO manufactures a range of conductive die attach adhesive with excellent adhesion to a wide variety of substrates (FR4, gold-plated alumina, LCP, PETP, etc.). They are used in a wide range of die bonding applications, where electrical conductivity is required, including semiconductor assembly onto lead-frames, microelectronic hybrid assembly onto alumina, high-reliability devices and commercial PCB Chip-on-Board applications, etc.
More detailed information on DELO’s range of conductive die attach adhesives can be found here.
Adhesives Key Features
- Silver-filled conductive die attach adhesive
- Epoxy with conductivity in all three axes
- Meets MIL-STD-883 requirements for die shear strength
- Optional light-fixing capability for high accuracy placement
- Low temperature curing for sensitive substrate materials
- Extended pot life
Ideal for high precision applications
Conductive die attach adhesives are based on a silver-filled epoxy and are also known as isotropic conductive adhesives. A feature of the adhesive is that it can be snap-cured with light to fix them in-place before a final full cure, making them ideal for high precision applications.
Light fixed, heat cured
Light-fixing the visible fillet of the adhesive around the die takes as little as 1 second, and this ensures that there is no movement of the die between die placement and curing. Heat-curing of the epoxy is mandatory, and can take as little as 10 minutes at 100°C or 30 minutes at 80°C.
Got a Question About Conductive Die Attach Adhesives?
Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help.
From selecting the right adhesive to optimising your curing process, we provide technical guidance, documentation, and samples to support your application needs.
Knowledge Base Articles
Description
Description
Adhesives for Die Attach (IKB-071)
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Die Attach Process: Guidance and Setup (IKB-072)
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Understanding Shear Test: Ball Bond and Die Shear (IKB-018)
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MIL STD 883 Shear Testing (IKB-026)
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Description
Light Activated Adhesives (IKB-045)
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Description
Basic Adhesive Types (IKB-041)
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Description
How to Choose the Right Adhesive (IKB-035)
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All Things Considered (IKB-042)
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Related Products
Further Information
Applications
Bonding, Sealing, Encapsulation, Potting, Protection Against Vibration, Securing, Dam & Fill
Industry Segments
Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.
Delo Website
Region
Available from Inseto in the United Kingdom & Ireland
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