Ball Bond Sequence

The Ball Bond sequence for both manual and automatic wire bonding machines can be explained in seven steps:

• STEP 1: BALL FORMATION: Spark from EFO wand melts wire to form ball for first bond.
• STEP 2: FIRST BOND: Ball bond ready to commence. Tool brought over first bond position (X, Y) and down into contact with surface – force is pre-set value – ultrasonic energy applied for pre-set time to form first bond.
• STEP 3: LOOP HEIGHT: Tool is raised to pay wire out from spool (clamps open) to loop height value.
• STEP 4: LOOP FORMATION: Tool moved to second bond position (manually or automatically).
• STEP 5: SECOND BOND: Tool brought into contact with surface – second bond made as step 2.
• STEP 6: TERMINATION: Following 2nd bond, tool moves up to pre-set height (tail), clamps close and break off wire at 2nd bond heel.
• STEP 7: BALL FORMATION: Automatic repeat of step 1 to begin cycle again.