Large Diameter Aluminium Bonding Wire
Large Diameter Aluminium Bonding Wire Key Features
- Large diameter aluminium bonding wire up to 99.999% purity
- Used in high power / high current applications
- Diameters from 125µm (0.005″) to 500µm (0.020″)
- Low cost alternative to gold, especially suited to the automotive industry
Inseto supplies large diameter aluminium bonding wire manufactured by AMATEK-Coining, designed for power electronics and high-current applications. This wire offers superior conductivity and mechanical strength, making it ideal for demanding environments such as automotive, industrial, and energy systems.
Aluminium wire is used throughout the electronics industry due to its low cost, its suitability for ultrasonic wedge bonding, and the elimination of “purple plague” that is associated with gold wire bonded to aluminium pads / substrates.
Heavy / large aluminium bonding wire for microelectronics is drawn from one of three materials: 5/9’s pure aluminium, 4/9’s pure aluminium, or 0.5% Mg aluminium alloy. 4/9’s wire is doped with nickel to increase corrosion resistance, making it the material-of-choice for most applications. For very high power applications, 5/9’s wire is preferred due its increased elongation, making the wire softer and therefore easier to bond.
The 5/9’s, 4/9’s and 0.5% Mg aluminium wires each exhibit unique properties, which can be used to overcome any unusual bonding conditions that may be experienced.
Large Diameter Aluminium Bonding Wire Technical Downloads
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Coining Aluminium Bonding Wire Data Sheet
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Coining Company Brochure
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Further Information
What Is Large Diameter Aluminium Bonding Wire?
Large diameter aluminium bonding wire, often referred to as heavy aluminium bonding wire, is used to create high‑current electrical interconnects in power semiconductor and microelectronic assemblies. Unlike fine bonding wire, which is primarily used for signal transmission, large diameter aluminium wire is designed to carry substantially higher currents while also providing robust mechanical and thermal performance.
The wire is applied using ultrasonic wedge‑to‑wedge bonding techniques and is a well‑established interconnect technology for power devices and automotive electronics. Typical wire diameters range from approximately 125µm to500 µm.
Key characteristics of Large Diameter Aluminium Bonding Wire include:
- The large cross‑section of heavy aluminium bonding wire allows it to safely carry high electrical currents without excessive resistive heating.
- Aluminium offers good thermal conductivity, enabling efficient heat dissipation away from the bond area and device.
- Large diameter aluminium bonding wire forms reliable metallurgical bonds to aluminium pads and substrates. This compatibility avoids gold–aluminium intermetallic issues, often referred to as “purple plague”, and supports robust bonding in both hermetic and non‑hermetic packages.
- The mechanical strength and ductility of heavy aluminium wire provides resistance to vibration, thermal cycling, and mechanical stress in harsh operating environments.
Inseto Knowledge Base Document:
Read our free guide to “What is Wire Bonding?“
Wiki – Wire Bonding Overview:
Applications for Bonding Wire and Ribbon
Wire Bonding, Ribbon Bonding, Battery Assembly, Material Interconnect, etc.
Industry Segments
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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