Bathtub & Flatpack Packages
Bathtub & Flatpack Packages Key Features
- Compression sealed and matched sealed options
- Complete in-house plating capabilities
- All packages manufactured to MIL-STD-883 as minimum
- Full in-house testing capability to MIL-PRF-38534
Egide offers comprehensive solutions to the more traditional hybrid thick-film technologies. It has been manufacturing glass-to-metal-sealed packages since its inception in 1986, so has a long and extensive history with these types of packages. It has numerous conveyor furnaces for all joining process, from low-temperature soldering to high-temperature brazing.
A wide range of bathtub packages (sometimes called “plug-ins”) and flatpacks, usually made from KovarTM, compliments more specialised requirements in the Power & RF markets. Fully automated, computer-controlled electroplating lines ensure that the most critical process in hermetic package manufacturing is under complete control.
Egide offers both compression sealing and matched sealing. In compression-sealed packages, the reliability of the seal is guaranteed by the thermal expansion of glass and metal creating the necessary concentric compressive stress to meet stringent hermeticity requirements. The matched sealing process uses the match of the thermal expansion coefficients of Kovar and glass over a wide temperature range. An oxide layer created between metal and glass provides for the hermeticity and electrical insulation.
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Further Information
What are Bathtub and Flatpack Packages
Bathtub packages and flatpacks are hermetically sealed microelectronic housings commonly used in hybrid and thick‑film electronic assemblies. They provide a robust, gas‑tight enclosure that protects sensitive components from moisture, contaminants and environmental stress while enabling reliable electrical interconnection.
Bathtub packages, sometimes referred to as plug‑in packages, typically feature leads arranged perpendicular to the mounting surface, while flatpacks have leads arranged in a plane parallel to the substrate. Both package types are widely used in high‑reliability applications where proven hermetic sealing, mechanical strength and long‑term stability are essential.
Key characteristics of bathtub and flatpack microelectronic packages
- Available with compression‑sealed or matched‑sealed glass‑to‑metal interfaces to achieve reliable hermeticity over wide temperature ranges.
- Well‑proven package styles for traditional hybrid and thick‑film microelectronic assemblies.
- Typically manufactured from materials such as Kovar, providing mechanical strength, dimensional stability and compatibility with hermetic sealing processes.
- Designed and tested to meet recognised hermetic package standards used in high‑reliability electronic applications.
Inseto Knowledge Base Document:
Read our free guide to the “Die Attach Process: Guidance & Setup“
Wiki – Semiconductor Device Fabrication:
Applications
High Reliability Hermetic Packages, Microelectronic Hybrid Housings, Power Semiconductor Assemblies, Microwave Assemblies, Optical Packages, Thermal Imaging Sensors etc.
Industry Segments
Wireless, Internet Infrastructure, Military, Aerospace, Industrial, Telecommunications, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly etc.
Egide Website
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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