Hermetic Power Packages
Hermetic Power Packages Key Features
- Choice of glass sealing or ceramic sealing technologies
- Wide range of thermal management base materials
- Pin materials include copper-cored-Kovar
Egide’s range of hermetic power packages is designed to meet demanding environmental requirements, where high reliability and strength are essential.
Typical applications include power converters, motor drives, switch mode power supplies, power hybrid circuits, and power thrusters for military, aeronautic and space applications. Using either glass-to-metal-seal (GTMS) or ceramic-to-metal-seal (CTMS) feed-thru technology, they are available as standard product form types (TO-254, TO-257, …) or specifically designed to meet customers’ requirements.
Copper-cored pins allow for high current ratings that meet the most demanding applications.
Thermal conductivity is assured by choosing the base material of choice – Tungsten-Copper or Moly-Copper are the usual customer choice, but other highly-thermally conductive base materials are also available.
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Further Information
What are Hermetic Power Packages
Hermetic power packages are sealed metal and ceramic enclosures designed to house power semiconductor devices operating at high current and high voltage. They provide an hermetic internal environment that protects sensitive devices from moisture, contaminants and atmospheric gases, ensuring long‑term electrical stability and reliability. By design, hermetic seals prevent the ingress of liquids and gases into the package cavity where the semiconductor die is mounted.
The packages are engineered to manage significant thermal and electrical loads, often incorporating robust materials and integrated heat‑spreading structures to support effective thermal management. They are widely used in demanding and high‑reliability applications including aerospace, defence and industrial systems.
Key characteristics of hermetic power packages
- Provide a hermetic seal that prevents the ingress of moisture, gases and contaminants into the package cavity, protecting the semiconductor die and internal interconnections from corrosion and electrical degradation.
- The packages are designed to support high‑power operation, with robust internal feedthroughs and pin materials that enable reliable performance under high current and high voltage conditions in demanding applications.
- Hermetic power packages incorporate thermally conductive base materials, such as copper‑tungsten or molybdenum‑copper, to efficiently dissipate heat away from the device, supporting stable operation and extended service life.
- Constructed from metal and ceramic materials, hermetic power packages offer high mechanical robustness and resistance to harsh environmental conditions, making them suitable for long‑life, high‑reliability systems where maintenance or replacement is limited.
Inseto Knowledge Base Document:
Read our free guide to the “Die Attach Process: Guidance & Setup“
Wiki – Semiconductor Device Fabrication:
Applications
Power Electronic & Power Semiconductor Assemblies.
Industry Segments
High Reliability Military, Aerospace, Industrial and Space
Egide Website
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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