Optoelectronic Packages
Over the last 2 decades, opto-electronic devices have found their way into various applications like high-speed telecommunication networks, data center interconnection, gas sensing, thermal imaging, gyroscopes, etc. High-speed fiber-optic networks have increased the need for high density complex interconnection solutions.
What are Optoelectronic Packages?
Optoelectronic packages are hermetically sealed housings designed to protect and interconnect devices that transmit, detect or process light, such as fibre‑optic components and photonic sensors. They provide a controlled internal environment that preserves optical performance while ensuring reliable electrical and thermal interconnection in demanding applications.
These packages are used across a wide range of optoelectronic systems, including high‑speed telecommunications, data centre interconnection, sensing and imaging. A combination of metal, ceramic and glass‑sealed technologies enables solutions to be tailored for high‑frequency, high bit‑rate operation and harsh environmental conditions.
Key Features of Optoelectronic Packages
- Wide range of fibre-optic packages
- Markets include submarine, long-haul, metro, etc.
- Mix of technologies – metal, HTCC, GTMS, CTMS
- Dedicated customer-facing Field Application Engineering department
Optoelectronic Packages Resources
Egide Fibre-Optic Packages Flyer
About Egide Capabilities
Egide’s multilayer high-temperature co-fired ceramic (HTCC) technology, together with complete in-house RF simulation capabilities, makes it a unique player in the market for high frequency / high bit rate packages used for 100G & 400G TOSA/ROSA and modulator designs.
Both GTMS (glass-sealed) and CTMS (ceramic-sealed) options are offered, as well as in-house manufactured RF terminals and DC pin assemblies.
About Egide Optoelectronic Packages
Opto-electronic sensors are used in a wide variety of applications, some of which are in harsh environmental conditions. Egide’s hermetic packaging technology, ensuring protection and interconnection of the opto-electronic ICs, meets the most stringent requirements that these environments impose. Examples are gas sensing in industrial environment, fiber-optic gyroscopes, etc.
Key Characteristics of Optoelectronic Packages
- Protects sensitive optoelectronic devices from moisture, gases and environmental contamination.
- Supports high‑frequency and high bit‑rate applications, including advanced fibre‑optic communication modules.
- Available using metal, HTCC, glass‑to‑metal and ceramic‑to‑metal sealing approaches to meet different performance and integration requirements.
- Suitable for use in telecommunications, data centres, sensing, gyroscopes and thermal imaging systems.
Got a Question About Optoelectronic Packages?
Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help.
From selecting the right hermetic power package to optimising your processes, we provide technical guidance, documentation, samples and on-site training to support your application needs.
Knowledge Base Articles
Related Products
Further Information
Wiki – Semiconductor Device Fabrication
Applications
High Reliability Hermetic Packages, Microelectronic Hybrid Housings, Power Semiconductor Assemblies, Microwave Assemblies, Optical Packages, Thermal Imaging Sensors etc.
Industry Segments
Wireless, Internet Infrastructure, Military, Aerospace, Industrial, Telecommunications, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly etc.
Egide Website
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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