Optoelectronic Packages
Optoelectronic Packages Key Features
- Wide range of fibre-optic packages
- Markets include submarine, long-haul, metro, etc.
- Mix of technologies – metal, HTCC, GTMS, CTMS
- Dedicated customer-facing Field Application Engineering department
Over the last 2 decades, opto-electronic devices have found their way into various applications like high-speed telecommunication networks, data center interconnection, gas sensing, thermal imaging, gyroscopes, etc. High-speed fiber-optic networks have increased the need for high density complex interconnection solutions.
Egide’s multilayer high-temperature co-fired ceramic (HTCC) technology, together with complete in-house RF simulation capabilities, makes it a unique player in the market for high frequency / high bit rate packages used for 100G & 400G TOSA/ROSA and modulator designs.
Opto-electronic sensors are used in a wide variety of applications, some of which are in harsh environmental conditions. Egide’s hermetic packaging technology, ensuring protection and interconnection of the opto-electronic ICs, meets the most stringent requirements that these environments impose. Examples are gas sensing in industrial environment, fiber-optic gyroscopes, etc.
Both GTMS (glass-sealed) and CTMS (ceramic-sealed) options are offered, as well as in-house manufactured RF terminals and DC pin assemblies.
Optoelectronic Packages Downloads
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Egide Fibre-Optic Packages Flyer
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Further Information
What are Optoelectronic Packages
Optoelectronic packages are hermetically sealed housings designed to protect and interconnect devices that transmit, detect or process light, such as fibre‑optic components and photonic sensors. They provide a controlled internal environment that preserves optical performance while ensuring reliable electrical and thermal interconnection in demanding applications.
These packages are used across a wide range of optoelectronic systems, including high‑speed telecommunications, data centre interconnection, sensing and imaging. A combination of metal, ceramic and glass‑sealed technologies enables solutions to be tailored for high‑frequency, high bit‑rate operation and harsh environmental conditions.
Key characteristics of optoelectronic packages
- Protects sensitive optoelectronic devices from moisture, gases and environmental contamination.
- Supports high‑frequency and high bit‑rate applications, including advanced fibre‑optic communication modules.
- Available using metal, HTCC, glass‑to‑metal and ceramic‑to‑metal sealing approaches to meet different performance and integration requirements.
- Suitable for use in telecommunications, data centres, sensing, gyroscopes and thermal imaging systems.
Inseto Knowledge Base Document:
Read our free guide to the “Die Attach Process: Guidance & Setup“
Wiki – Semiconductor Device Fabrication:
Applications
High Reliability Hermetic Packages, Microelectronic Hybrid Housings, Power Semiconductor Assemblies, Microwave Assemblies, Optical Packages, Thermal Imaging Sensors etc.
Industry Segments
Wireless, Internet Infrastructure, Military, Aerospace, Industrial, Telecommunications, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly etc.
Egide Website
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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