Thermal Imaging HTCC Packages
Thermal Imaging HTCC Packages Key Features
- Packages for cooled and un-cooled detectors
- Tested for hermeticity to 10-10 cm3/s atm
- HTCC manufactured in-house
- Complete assembly and plating in the EU
Egide customs designs and manufactures packages for the thermal imaging market based upon its proven, reliable HTCC (High Temperature Co-fired Ceramic) technology. All ceramic parts are manufactured in-house from basic inks and powders up to the finished multi-layered product, with gold plated tracks and tungsten-filled vias.
Egide governs the components and the design, ensuring tight dimensional control and problem-free integration, resulting in assembled devices of the highest quality and reliability. Glass-sealed packages are also available. All Egide packages are tested for hermeticity to 10-10 cm3/s atm and the high temperature process reduces critical pumping time. The assembled parts can be plated with electrolytic or electroless nickel and electrolytic or electroless gold.
Egide also plates copper tracks on ceramic for high power applications. They offer much more than just the basic package, adding TECs, getter holders, copper pinch-off tubes, window holders and envelopes as required, so that all customers receive a more complete component and save in-house production space for other requirements.
Thermal Imaging HTCC Packages Downloads
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Egide – Products for Thermal Imaging
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Further Information
What are Thermal Imaging HTCC Packages
Thermal Imaging HTCC packages are hermetically sealed ceramic enclosures used to house cooled and uncooled infrared detectors in thermal imaging systems. Manufactured using High Temperature Co‑Fired Ceramic technology, they protect sensitive devices from moisture and environmental stress while providing reliable electrical and thermal interconnection.
They are manufactured using multilayer ceramic structures with gold‑plated tracks and tungsten‑filled vias, ensuring tight dimensional control, robust hermeticity and reliable integration. The packages are tested to very low leak rates and can incorporate features such as thermoelectric coolers, getters, window assemblies and pinch‑off tubes to deliver a complete thermal imaging packaging solution.
Key characteristics of thermal imaging HTCC packages
- Designed for use with both cryogenically cooled and uncooled infrared detectors across a wide range of thermal imaging applications.
- Tested for hermeticity to very low leak rates, protecting sensitive imaging devices from moisture and environmental contamination.
- Manufactured from multilayer HTCC ceramic structures, with gold‑plated tracks and tungsten‑filled vias for reliability and dimensional control.
- Can incorporate additional elements such as thermoelectric coolers, getters, window assemblies and pinch‑off tubes
Inseto Knowledge Base Document:
Read our free guide to the “Die Attach Process: Guidance & Setup“
Wiki – Semiconductor Device Fabrication:
Applications
High Reliability Hermetic Packages, Microelectronic Hybrid Housings, Power Semiconductor Assemblies, Microwave Assemblies, Optical Packages, Thermal Imaging Sensors etc.
Industry Segments
Wireless, Internet Infrastructure, Military, Aerospace, Industrial, Telecommunications, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly etc.
Egide Website
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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