Bond Test Process Methods

Nordson DAGE is a world leader in developing and manufacturing equipment and test methods for destructive and non-destructive testing of electronic components and precision assemblies.

Machines are used to support research, production, quality assurance or failure analysis in order to qualify new materials or assembly processes, evaluate equipment setup and to determine device reliability and long term performance.

All Nordson-Dage equipment models are capable of the basic bond test methods, including: wire pull, tweezer peel-pull, bond shear and die Shear, including micro-flex bend test etc.

These newer test methods, developed in conjunction with leading institutes and component manufactures are used to ensure reliability and performance in the most challenging electronic assembly applications.

Nordson-DAGE bond test systems can be found in a wide range of industries, including semiconductor, aerospace, automotive, telecommunications, medical, consumer and high reliability etc.

The equipment range and capabilities are as follows:

• 4000 Stellar: Manual wire pull and bond test system
• 4600: Automated wire pull and bond test system
• 4600-W: Automated Wafer level bond tester
• 4000 Plus: Advanced wire pull, bond test capabilities

Click on the images below to see an overview of the different test methods (note, not every method/process is listed) and the respective equipment model the test method is available on.