The 4000 Optima is now end-of-life.

Applications

Semiconductor Defect Analysis & Characterisation, Wire Bond Testing, Validation Of Process & Machine Setup, In Process Quality Control, Wire Bond Strength Analysis, Materials Testing, Die Shear & Bond Shear Strength Checks including: Ball Shear/Solder Ball Shear, Cold Bump Pull, Die Shear, First Bond Ball Pull/Stud Bump Pull, High Force Pull, High Strain Rate, Ribbon Peel, Ribbon Pull, Stud Pull, Tweezer Pull, Vector Pull, Wedge Shear, Wire Pull & Zone Shear.

Industry Segments

Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fibre Optics, Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices

Nordson-DAGE Website

www.nordson.com