Flexural Bend Testing: 3, 4 Point & Micro Bend Test
Flexural Bend Test Overview:
- Test material elasticity and flexural strain
- Evaluate PCB laminate strength and failures
- Evaluate solder materials and process variables
- Evaluate effects of die thinning brittle failures
- Destructive, non-destructive & fatigue testing
- Test according to ASTM D790 and D6272, IPC-TM-650, SEMI G86-0303 & JEDEC 9702 standards etc.
Flexural bend testing uses bending, flexural stress and flexural strain to determine a materials elasticity and its ability resist deformation under load.
Different bend methods, including 3 point, 4 point and micro-bend result in differing stress distributions.
3 point and 4 point bend test is used for general materials testing and can be applied to organic substrates (PCB laminates for example) to measure rigidity and flexural strength.
The 3 point flexure fixture produces its peak stress at the specimen mid-point with reduced stress elsewhere. This stress localisation is ideal for testing for specific isolation of stress on a component or material.
The 4 point flexure fixture produces peak stresses along an extended region of the specimen hence exposing a larger length of the specimen with more potential for defects and flaws to be highlighted.
Micro bend solutions are ideal for assessing the impact of defects introduced by dicing or surface grinding on the strength of brittle materials.
Flexural Bend Test – Available on:
Further Information
Applications
PCB Defect Analysis & Materials Characterisation, Semiconductor Process Characterisation
Industry Segments
Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fibre Optics, Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices
Nordson-DAGE Website
Region
Available from Inseto in the United Kingdom, Ireland, Sweden, Denmark, Norway and Finland
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