Passivation Bond Shear Test
Passivation Bond Shear Test Overview:
- Shear test embedded bump & ball bonded features
- Consistent bond force measurements
- Sharp shear tool cuts through passivation layer
- Available on 25 and 250 gram shear cartridges
Shear testing ball or bump bonded interconnections on the surface of devices with passivation layers is difficult. This is due to the nature of the protective coating, which is well-adhered to the surface. Further complications arise from the interconnects being embedded by up to 10um within the layer. Passivation shear is a test mode designed to cut through the layer and only record the shear force from the interconnect of interest.
The sharp passivation tool will touch the surface perpendicular to the device being tested, record the height and move forward slowly until it detects contact on the tool tip. The tool will then move backward to the designated offset and perform the typical passivation shear through the material until a set distance is reached.
The passivation bond shear test software prioritises the data collection from the interconnect, showing the operator only the relevant results required for analysis.
The shear tool position during testing is critical for accurate and repeatable test results. Nordson DAGE cartridges find the device surface using a sensitive touchdown feature. High precision positioning provides shear height accuracies of +/- 0.25 microns. Touchdown is achieved using a patented load cartridge clamping system, which ensures every bond is sheared at the same height relative to the surface that it is bonded on.
Further Information On Passivation Bond Shear Test
File
Application Note: Overcoming Passivation Layer Interference in Ball Shear Testing
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File
View All Test Methods
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Passivation Shear Test – Available on:
4000 Plus: Bond & Materials Test Equipment

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4600: Automated Bond Test Equipment

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4600-W Wafer Level Bond Test Equipment

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Further Information
Applications
Semiconductor Defect Analysis & Characterisation, Ball Shear Testing, Validation Of Process & Machine Setup, In Process Quality Control, Bond Strength Analysis, Materials Testing
Industry Segments
Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fibre Optics, Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices
Nordson-DAGE Website
Region
Available from Inseto in the United Kingdom, Ireland, Sweden, Denmark, Norway and Finland
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