Wafer Laser Trimmer – WT35X0
Key Features
- Fully integrated laser trimmer and test system for wafer processing
- Laser source control to support process consistency and yield
- Advanced image processing and motion systems for improved positioning
- Optional short pulse or long pulse laser source configurations
- Configurable platform to support different materials and applications
The WT35X0 Wafer Laser Trimmer from Photonics Systems Group is designed for precise trimming and circuit matching at wafer level, particularly in power semiconductor applications. It combines a fully integrated laser trimmer and test system with advanced motion control, image processing, and laser source control to support consistent processes and high yield in wafer processing.
The WT35X0 platform is available in short pulse and long pulse variants, including the WT3510 short pulse and WT3520 long pulse configurations:
- Short pulse lasers are commonly used for fine geometry trimming and applications requiring minimal thermal impact
- Long pulse lasers are commonly used where higher energy delivery supports stable trimming of larger features or different material stacks
System options include automation support and configurable chuck and laser source selections to match specific wafer materials and trimming requirements.
Wafer Chuck & Handling
The WT35X0 is built around a closed loop X, Y, Z and theta stage for wafer positioning and alignment. An optional wafer handler adds a 3 axis servo controlled robot and pre aligner, supporting automation for higher throughput wafer processing.
The system supports 100 mm to 200 mm wafers and can process partial wafers. Chuck finishes include Al, Ni or Au, with an optional hot chuck.
High Precision Trimming Capability
The platform supports fine feature trimming, including the ability to cut 2 µm wide links. It also supports trimming of 78 microinches wide links, enabled by a precision staging system (x, y, z, theta) and controlled laser pulse placement.
Probing and Test Integration
The platform supports probe card based operation, with probe card size listed as 4.5 to 9 inch standard, 12 inch optional, plus probe vision options including automatic probes to pads alignment and ± 4 µm accuracy. Integration support includes an Enhanced Tester Interface (ETI) and stop trim I/O, and connection options to VXI, PXI and GPIB instrumentation and custom test solutions. An optional PSG V2000 measurement system is listed for high precision sourcing and measurement functions.
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Further Information
What is Wafer Laser Trimming
Wafer laser trimming is a precision process used to adjust and match electrical circuits directly at wafer level by selectively removing material with controlled laser pulses. It is applied after wafer fabrication to fine tune electrical or functional parameters without mechanical contact, supporting tight tolerances, high repeatability, and stable device performance across the wafer.
The process is commonly used in semiconductor and power electronics manufacturing where accurate wafer level calibration and consistency are critical.
Key characteristics of wafer laser trimming:
- Wafer level adjustment of electrical circuits and functional parameters after fabrication
- Contact free laser processing without mechanical stress or physical interaction
- Micron level trimming accuracy for fine feature and tolerance control
- High repeatability across the wafer to support consistent device performance
Wiki – Laser Trimming
Applications
Wafer level circuit trimming and matching, Power electronics wafer processing, Precision laser trimming of wafer based devices
Industry Segments
Semiconductor Wafer Fabrication
PSG Website
Region
Available from Inseto in the United Kingdom, Ireland, Finland, Norway & Sweden.
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