MA/BA Gen4 Series Mask Aligner
MA/BA Gen4 Series Key Features
- Small Footprint Design
- Contact Modes: Proximity, Soft, Hard & Vacuum
- Uniformity < 2.5% (200mm)
- Alignment Method: Top Side (TSA), Bottom Side (BSA) & IR
- Manually Assisted, Automatic & Direct Wafer Alignment
- Processes pieces from 5x5mm up to 200mm Diameter Wafers
The MA/BA Gen 4 series is the latest generation of mask aligner and bond aligner for research and development or small volume production from SUSS.
The MA/BA Gen 4 is available in two versions, the MABA6 Gen4 for processing pieces up to 150mm wafers / substrates, or the MABA8 Gen4, for processing pieces up to 200mm wafers / substrates. Used in the fabrication of photonic devices for bio-photonics and in the development of novel quantum dot displays, the MA/BA Gen4 is a flexible mask aligner suitable for R&D and limited volume manufacturing environments.
A compact ergonomic design, coupled with intuitive alignment software and sophisticated data-logging capability, make exposure processes setup and adjustment simple, minimising costly process errors.
The MA/BA Gen 4 now comes with SUSS patented MO exposure optics integrating High Resolution (HR) and Large Gap Optics (LGO) into a single, plug & play optical setup.
Traditional Mercury lamp houses can be exchanged LED lights sources, which not only reduce maintenance and operational costs, but provide an energy efficient, environmentally sound alternative to toxic Mercury Bulbs.
MA/BA Gen4 Series Technical Downloads
File
SUSS MA/BA Gen4 Series Mask Aligner Datasheet
Download
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Knowledge Base Articles
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What Is A Mask Aligner (IKB-068)
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Photolithography Basics (IKB-038)
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Imprint Photolithography (IKB-054)
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Photolithography Exposure Modes (IKB-053)
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Semiconductor Wafer Selection Guide (IKB-046)
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Semiconductor Wafer Description Nomenclature (IKB-044)
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Further Information
What is a Mask Aligner and Bond Aligner?
A mask aligner and bond aligner is a semiconductor processing system that combines photolithography exposure with precise substrate alignment for wafer or substrate bonding. It enables accurate mask to wafer alignment for patterning, as well as reliable alignment of substrates prior to bonding.
These systems are used in processes such as UV lithography, bond alignment and wafer bonding, supporting advanced microfabrication workflows in research, pilot production and low volume manufacturing. They are commonly applied in MEMS, advanced packaging and 3D integration where precise alignment is critical.
Inseto Knowledge Base Document:
Read our guide to the “Wafer is a Mask Aligner?“
Wiki – Semiconductor Device Fabrication
Applications
UV Lithography, Wafer Bond Alignment, Wafer Bonding
Industry Segments
Wafer level chip-scale packaging, flip chip packaging, bumping, MEMS, LED, power devices, optical components and compound substrates and other semiconductor related device R&D applications
SUSS Website
Region
United Kingdom, Ireland, Finland, Sweden, Estonia, Iceland & Norway
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