MA100/150e Gen2 Automatic Mask Aligner
MA100/150e Gen2 Key Features
- High Volume Automated Mask Aligner
- Optimised for up to 100 (4″) or 150mm (6″) wafers
- Simultaneous handling of 3 wafers allows > 145 wafer per hour
- Alignment functions for scribed, transparent or textured wafers
- SUSS Diffraction Reducing Optics for optimal print resolution
- Non-contact Pre-Align & Flat Finders
- Process Single Wafers or Wafers on Carrier Substrates
The SUSS MA100/150e Gen2 was developed to support various high volume market segments, such as HB-LEDs, Compound Semiconductors, Power Devices and RF-MEMS.
The system is optimised for wafers up to 150mm in diameter and offers exceptional process scalability with an industry leading throughput of 145 wafers per hour; including alignment and exposure times.
Alignment accuracy of < ± 0.7um is readily achievable with the SUSS Direct-Align function, while the optional BSA can achieve < ±1.5um.
For scribe line applications, SUSS MicroTec have a sophisticated “Line Alignment” function for precise alignment of pre-scribed glass wafers to the photo mask, without need of traditional wafer targets.
MA100/150e Gen2 Automatic Mask Aligner Technical Downloads
File
SUSS MA100/150e Gen2 Series Mask Aligner Datasheet
Download
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Knowledge Base Articles
Description
Description
What Is A Mask Aligner (IKB-068)
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Photolithography Basics (IKB-038)
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Imprint Photolithography (IKB-054)
Link
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Photolithography Exposure Modes (IKB-053)
Link
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Semiconductor Wafer Selection Guide (IKB-046)
Link
Description
Semiconductor Wafer Description Nomenclature (IKB-044)
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What is Spin Coating? (IKB-075)
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Further Information
What is an Automatic Mask Aligner?
An automatic mask aligner is a fully automated photolithography system used in semiconductor manufacturing to precisely align photomasks to wafers and transfer patterns at high throughput. Automatic mask aligners support repeatable, sub-micron alignment accuracy and are designed for production environments.
Key Features of an Automatic Mask Aligner
- Fully automated wafer loading, alignment, exposure and unloading
- Sub micron mask to wafer alignment
- Multiple exposure modes: proximity, soft, hard & vacuum contact
- Uniform and stable illumination optics for consistent exposure
- Automatic mask storage and selection
- Support for wafers and substrates, including thin or warped wafers
- High overlay accuracy and yield stability
- Compact, cleanroom compatible design
Inseto Knowledge Base Document:
Read our guide to the “Wafer is a Mask Aligner?“
Wiki – Semiconductor Device Fabrication
Applications
UV Photo Lithography
Industry Segments
Semiconductor wafer and panel fabrication.
SUSS Website
Region
United Kingdom, Ireland, Finland, Sweden, Estonia, Iceland & Norway
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