High Force Die Bonder: Tresky T-5500
Tresky T-5500 Key Features
- High force die bonder up to 100Kg
- Ideal for Sintered Die Attach or Flip Chip Bonding
- Active Bond Force Control
- >1μm placement accuracy
- Motorized, 120mm programable Z-axis
- Motorised 360° Pickup Tool rotation
The Tresky T-5500 High Force Die Bonder has been developed for attaching semiconductor chips, where higher bond forces are required. For example: sintered die attach, bonding die attach film, thermo-compression flip chip bonding and anisotropic adhesive processes etc.
The system incorporates semiautomatic process capabilities and an advanced graphical user interface for setting die bonding parameters, solder reflow or curing temperature profiles and for video imaging of beam splitter optics and process inspection camera options.
Repeatable, high-accuracy die bonding and flip-chip processes are made possible due to Tresky’s True Vertical Technology™ in the motorised Z axis, featuring a motorized 360° pickup tool and optional optional beam splitter optics. The True Vertical Technology™ ensures an absolute co-planarity between chip and substrate at any height and force during bonding process. The automated motorized axis with active bond force control enables a high repeatability of the programmed bonding parameters.
Tresky has been synonymous for perfect micro-assembly equipment in the world of R&D and small-scale production. Customers know and love Tresky because the equipment is so easy to learn and use: you can be productive from day one. Manufactured with Swiss precision and dedication to engineering, the machines can remain in use for many years, and they can be adapted and expanded for a large variety of new and evolving applications, keeping the investment always at the cutting edge of technology.
Tresky T-5500 Technical Downloads
File
Tresky T-5500 HF Die Bonder Datasheet
Download
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Further Information
What is Thermocompression Die Bonding?
Thermocompression die bonding is a die attach process that uses controlled heat and pressure to form a direct metal to metal bond between a semiconductor die and a substrate, without the use of adhesives or solder. During bonding, metallic contact surfaces are pressed together at elevated temperature, allowing atomic diffusion to create a clean, electrically and thermally conductive solid state bond.
A closely related technique is thermosonic die bonding, which combines heat and pressure with ultrasonic energy.
Both techniques are commonly used in flip chip and advanced packaging applications where high reliability, precise alignment, and contamination free interconnections are required.
Key characteristics of thermocompression die bonding include:
- Direct metal to metal bonding using heat and pressure
- No adhesives, solder, or flux required
- High electrical and thermal conductivity
- Requires precise alignment and controlled bonding conditions
Inseto Knowledge Base Document:
Read our free guide to the “Die Attach Process: Guidance & Setup“
Wiki – Flip Chip
Applications
Flip Chip Die Attach, Sintered Devices, Thermosonic Bonding, Stacked Die Bond, Multi-Chip-Module Assembly, Bio Medical Assembly, MEMS Device Interconnect, Microelectronic Assembly, Research and Development.
Industry Segments
Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices
Tresky Website
Region
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark
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