Manual Die Bonding Machine: Tresky T-4909-AE
Tresky T-4909-AE Key Features
- Low cost manual die bonding machine
- Small footprint equipment
- True Vertical Technology™, guarantees parallelism during bonding
- X-Y air-cushioned 180 x 180 mm placement stage
- Programmable bond forces 20-400 grams
- 360 degree freely rotatable pickup spindle
- Flip Chip Bond Alignment Option
- For Epoxy, Eutectic, Ultrasonic & Flip Chip Bonding
- High-quality, Swiss-made
The T-4909-AE (40 Year – Anniversary Edition) is a low-cost manual die bonding machine with a superior ergonomic design. The T-4909-AE features a Raspberry Pi PC with a touch screen control for selection of the pick & place, dispensing, stamping, modes and for programming of the related bonding or dispensing parameters.
The system is suitable for manual die attach of hybrid microelectronic devices including MEMS, MCM’s, MOEMS, VCSEL, RFID, COB etc., using adhesive, eutectic/solder or flip chip processes.
As with all of Tresky’s products, the T-4909-AE incorporates True Vertical Technology™ which guarantees parallelism between the chip and substrate at any bond height. The model now features 95mm of Z axis travel, providing increased clearance for bonding into cavities, or for die on die and flip chip processes etc.
The T-4909-AE die manual die bonding machine’s ergonomic design ensures it is simple to use and operate, resulting in excellent performance and reliability. It is ideal for low volume production, research, development and for Universities, where users require a small footprint die bond machine that is quick and simple to setup and provides accurate placement capability.
In addition, the equipment capability/options include: a 360° rotating pickup tool, adhesive / solder dispenser, epoxy stamping, eutectic scrub, flip chip die bond alignment, pickup tool heating, secondary preform spindle, XY air-cushioned placement stage with micrometre control, which supports the waffle-gel packs, substrate holder and various heating plates.
T-4909-AE Manual Die Bonding Machine Downloads
File
Tresky T-4909-AE Datasheet
Download
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Further Information
What is Epoxy Die Bonding?
Epoxy die bonding is a widely used die attach process in which a liquid or paste epoxy adhesive, either conductive or non conductive, is used to bond a semiconductor die to a substrate, leadframe, or package.
The adhesive is typically dispensed or stamped onto the bonding surface, after which the die is accurately placed. The adhesive is then cured in a subsequent process, forming a permanent mechanical and, where required, electrical attachment.
Epoxy die bonding is widely used due to its process flexibility, low-cost and compatibility with a wide range of materials. It is also suitable for applications where lower process temperatures or stress compliance are required.
Key characteristics of epoxy die bonding include:
- Uses liquid or paste epoxy adhesives for die attach
- Compatible with a wide range of die and substrate materials
- Lower process temperatures compared with solder based die bonding
- Supports dispensing or stamping for controlled adhesive volume
Inseto Knowledge Base Document:
Read our free guide to the “Die Attach Process: Guidance & Setup“
Wiki – Integrated Circuit Packaging
Applications
Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Bio Medical Assembly, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, RFID, MOEMS, VCSEL, Eutectic Die Attach, Adhesive Die Bonding, Die Sort
Industry Segments
Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices
Tresky Website
Region
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark
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