Tresky T-5100 Manual Die Bonder
Tresky T-5100 Key Features
- Manual Die Bonder with pickup from up to 200mm sawn/scribed wafer
- Pick & place die from waffle pack, gel pack and tape etc.
- Sub-micron placement capability
- For epoxy, eutectic-solder, flip chip & sinter die attach processes etc.
- Precision die to die and die on die placement capability
- Integrated time pressure dispenser, optional stamping unit
- Simple to use with excellent ergonomics & high build quality
- Modular system covers virtually all die pick-place applications
- True Vertical Technology™, guarantees parallelism during bonding
The T-5100 is a universal manual die bonder suitable for a wide range of micro-assembly tasks. The equipment features a superior ergonomic design, high-accuracy, a large 220 x 220mm assembly area with 125 mm of vertical travel and an integrated time/pressure dispenser, making it ideal for R&D through low volume production or custom assembly.
Due to the intuitive software, programming and operating the T-5100 is possible with only a few minutes’ training.
The accuracy and repeatability of placing parts is excellent due to features such as a true, linear Z-Axis, Bond Force Control, XY Fine Alignment and high-resolution optics, enabling placement to sub-micron accuracies.
The T-5100-W version features up to a 200mm wafer table, which sits below the main table using Tresky’s latest electronic die ejection system, plus incorporates Treskys’ True Vertical Technology™ that guarantees parallelism between chip and substrate, at any bond height.
The machines rigid base is compact, fits on a lab desk and can be expanded with many different options, including eutectic scrub, gas heating, preform handling, tool heating, ultrasonic bonding, die flip and dynamic heated tooling etc., ensuring the system can be configured to suit even the most demanding manual die bonding requirements.
Tresky T-5100 Technical Downloads
File
T-5100 Manual Die Bonder
Download
Related Products
Vacuum Reflow Ovens
MORE
Die Shear and Materials Test
MORE
Solder Preforms & Ribbon
MORE
Die Bond Adhesives
MORE
Die Bond Tools
MORE
Knowledge Base Articles
Description
Description
Adhesives for Die Attach (IKB071)
Link
Description
Die Attach Process: Guidance and Setup (IKB-072)
Link
Description
Understanding Shear Test: Ball Bond and Die Shear (IKB-018)
Link
Description
Solder Die Attach For High Power Applications (IKB-016)
Link
Further Information
What is Eutectic Die Attach?
Eutectic die attach is a high reliability die bonding process used to permanently attach a semiconductor die to a metallised substrate or package using a eutectic metal alloy. Eutectic alloys melt and solidify at a single, precise temperature, allowing the die and substrate metals to alloy together and form a strong, void free bond with excellent thermal and electrical conductivity.
Precision solder preforms are commonly used in eutectic die attach to deliver an accurately controlled volume of eutectic alloy to the joint, ensuring consistent bondline thickness and repeatable process results. Alternatively, the eutectic alloy may be deposited at wafer level prior to dicing.
The process is widely used in applications where heat dissipation, electrical performance, and long-term stability are critical.
Key characteristics of eutectic die attach include:
- Uses eutectic alloys such as gold tin to form strong metallurgical bonds
- Requires precision die bonding tools and collets to control die placement accuracy
- Provides high thermal & electrical conductivity, ideal for power and RF devices
- Creates stable, low void bonds without the use of organic materials that may outgas
Inseto Knowledge Base Document:
Read our free guide to the “Die Attach Process: Guidance & Setup“
Wiki – Integrated Circuit Packaging
Applications
Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Bio Medical Assembly, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, RFID, MOEMS, VCSEL, Eutectic Die Attach, Adhesive Die Bonding, Die Sort
Industry Segments
Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices
Tresky Website
Region
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark
Request Form
Back to top