Wafer Contact Angle Goniometer: SURFTENS WH 300

OEG produce the SURFTENS WH 300 fully automatic wafer contact angle (Goniometer) and surface tension measurement tool used during semiconductor fabrication to analyze and control the adhesion, planarization and homogeneity of lithographic processes and coatings on up to 300mm wafers.

Surface free energy (SFE) of wafer substrates and layers used in semiconductor technology, can be investigated by contact angle measurements. Measuring the contact angle allows users to quickly optimize new process steps, as well as to better standardize known fabrication processes. Small changes in the surface property of wafers are seen as large, easily detected changes in the contact angle. A small investment of time to measure the contact angle, can give a large return by avoiding later production problems. To reduce defect density and feature sizes of resist structures (<1μm), a good adhesion of the resist is necessary. By the help of contact angle measurements, you can control the adhesion very easily.

The small-footprint, SURFTENS WH 300 is suitable for fully automatic testing of wafers in production environments. It is the ideal tool to investigate contact angle and surface free energy measurements, to help determine the wettability of semiconductor wafers and includes a 3-axis wafer handling robot, loadport, fan filter unit, wafer scanner, notching system and SECS/GEM interface.

SURFTENS WH 300 guarantees the highest reproducibility and measuring accuracy, combined with simple operation: A series of liquid test droplets (typically DI water) are produced by the automatic direct dispensing system across the wafer. The droplets are measured immediately after dispensing via the high-quality CCTV system to exclude errors, with a graphical analysis of the contact angle and test data displayed for the user.