Laser Assisted Bonding Equipment

PacTech’s laser assisted bonding equipment provides high accuracy, low thermal stress solutions for connecting material surfaces in advanced semiconductor and microelectronics packaging. The PacTech LAPLACE® product family supports demanding assembly applications where conventional thermal compression or oven reflow processes introduce excessive thermal or mechanical stress.

Laser Assisted Bonding Technology

PacTech laser assisted bonding uses localised, selective laser heating to introduce energy only at the interconnection area. This allows bonding, placement and reflow to be performed in a single step, without heating the entire substrate. As a result, thermal stress, warpage and damage to surrounding components are significantly reduced.

The technology is particularly well suited to thermally sensitive materials, ultra‑thin substrates and assemblies with CTE mismatch, where precise temperature control is essential.

LAPLACE® Laser Assisted Bonding Platforms

The LAPLACE® series includes multiple laser assisted bonding systems configured for different assembly requirements, including flip chip bonding and assembly, wafer level component assembly, laser assisted soldering, ACF and NCP interconnections, ultra‑fine pitch and cantilever bonding.

All models enable precise, low‑stress bonding without heating the entire substrate, making them suitable for 2D, 2.5D, 3D & 3.5D device architectures. LAPLACE® laser assisted bonding models comprise:

• LAB 300A: Laser reflow for flip chip assembly, ACF and NCP interconnections.
• LAB 600A: Incorporating compression bonding and laser assisted reflow.
• HT: Laser assisted soldering for discrete and power device assembly
• 3.5D: Ultra‑fine pitch cantilever and probe card bonding with rework option