Solder Ball Jetting Systems

PacTech’s SB² laser solder jetting systems provide a flexible, high precision solution for solder ball placement and wafer level solder bumping across a wide range of advanced packaging applications. Using a laser assisted, flux free and contactless process, SB² systems enable accurate solder ball attach on wafers, substrates and discrete devices with minimal thermal and mechanical stress.

Laser Assisted Solder Jetting Technology

PacTech’s SB² technology uses a single solder ball dispensing mechanism to place and reflow solder balls in a single step. A laser melts the solder ball as it is positioned, allowing precise placement onto defined pads without the need for flux, stencils or masks. This process delivers:

• Flux free soldering with no post reflow cleaning
• No mechanical contact with the device or wafer
• Highly localised heating for low thermal stress
• Flexible solder ball placement on arbitrary pad layouts
• Support for a wide range of solder alloys

SB² systems operate in both standard and jetting modes, enabling optimisation for different device types and production volumes.

SB² Solder Jetting Platforms

PacTech manufactures a range of SB² platforms to match different production requirements:

• SB² M: Entry level R&D, prototyping, reballing, repair and rework
• SB² SM: Prototyping, small volume production, reballing, repair and rework
• SB² Jet: Automated precision production and inline capable
• SB² SMs Quantum: Dual drawer, high throughput for continuous production
• SB² Compact: High volume compact workstation, inline capable
• SB² WB: Combines solder jetting with wire feeding for specialised wire bonding

The systems enable precise, laser assisted placement of solder balls using alloys including SnAgCu, SnAg, SnPb, AuSn, InSn and SnBi. Typical solder ball diameters range from 40 µm to 760 µm. Optional de balling and re balling functions are available for rework and yield improvement.

PacTech’s laser solder jetting technology is clean, precise, and flexible, and suitable for a wide range of laser soldering applications, including wafer level solder bumping and WLCSP, flip chip bumping and assembly, and BGA solder ball placement and rework. The technology is also used for MEMS packaging, sensor assembly, camera modules, micro optics, CSP packaging for smartphones and tablets, biomedical device assembly, and subcontract wafer and solder bumping services, where high accuracy and low thermal stress are critical.