uECES Electrochemical Etch-Stop Wet Bench
Electrochemical Etch-Stop Wet Bench
ETCHING MODULES:
- Single Wafer Version
- Overflow circulation with filtration
- Potentiostat that keeps the p/n-junction in reverse bias and monitors the current over time
- Customized Chamber number and Material Selection
- PLC controlled
- Touch Panel for easy operation
RINSING MODULE:
- Standard: Overflow Rinse
- Optional: QDR, SRD
The etching unit μChem-ECES is a wet chemistry process tool utilising an electrochemical etch-stop processes. The electrochemical etch-stop (ECES) is one of the most cost-effective, convenient and precise technique for fabricating thin, mono-crystalline silicon membranes.
The high precision and uniformity of the etch in an electrochemical etch stop process is derived from the differences in etching potentials in doped silicon. When in alkaline etching solutions, such as potassium hydroxide (KOH) or TMAH, n-type and p-type doped silicon layers have noticeably different etch potentials. The μChem-ECES utilises a potentiostat that monitors the current as the embedded p/n junction is etched. A peak in the current is observed when the desired depth is reached caused by a local excess generation of SiO2 at the surface. Etching modules are single wafer versions for up to 300 mm.
All process operating elements are integrated into the touch panel whilst the body of the system is manufactured from PP with transparent PVC doors. Both DI water and Nitrogen spray guns are integrated into the working surface of the μChem-ECES.
Technical Downloads
File
μECES Electrochemical Etch-Stop Wet Bench Brochure
Download
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Knowledge Base Articles
Further Information
What is Electrochemical Etch-Stop Wet Bench Equipment?
Electrochemical etch-stop wet bench equipment is a specialised wet process system used in semiconductor fabrication to achieve highly precise and uniform silicon etching based on electrochemical control of doped silicon layers. The process exploits the different etch potentials of n-type and p-type silicon in alkaline solutions, enabling etching to stop automatically at a defined p–n junction depth.
In semiconductor manufacturing, electrochemical etch-stop wet benches are primarily used for bulk micromachining applications such as the fabrication of thin silicon membranes for MEMS devices and sensors. Integrated sensors monitor the etch current in real time, providing accurate end-point detection and repeatable thickness control across the wafer.
Inseto Knowledge Base Document:
Read our guide to the “Semiconductor Photolithography Basics“
Wiki – Semiconductor Device Fabrication
Electrochemical Etch-Stop Applications
Cleaning, Etching and Dissolving Semiconductor Wafers and Substrates for MicroFluidic Devices, Power Semiconductors, MEMS Devices, Compound & GaN Materials, Photonic, Photovoltaic and LED Components etc.
Industry Segments
Semiconductor Wafer Fabrication, University Research and Development
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United Kingdom, Ireland, Finland, Sweden, Denmark, Estonia, Iceland & Norway
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