MCS8 LabCluster – Manual Wafer Coating System
MCS8 LabCluster Key Features
- Compact manual wafer coating system
- Processes pieces up to 200 mm wafers and substrates
- Smallest cleanroom footprint
- Wide range of options down to module level
- Flexible configuration with over 500 possibilities
- Single supply and waste management system
- Proven technology in SUSS HVM tools
The SUSS MCS8 manual wafer coating system offers the latest generation of coating and aqueous developing techniques in a unique lab-cluster configuration.
The MCS8 is designed and assembled to provide the greatest availability of functions on the smallest cleanroom footprint. Technologies which have proven themselves in SUSS high-volume production tools are thus accessible to laboratories, start-ups and for small-scale production through the MCS8.
The base units of the MCS8 are customizable frames for two individual modules. Customers select these two modules according to their process requirements from the wide range of manual and semi-automated coater and aqueous developer tools. These options include LabSpin8, Hot Plate, Vapour Primer or the actively chilled Cool Plate. The two individual modules are placed one behind the other. This allows optimal use of cleanroom space and ensures a compact footprint. For best operator ergonomics, the rear module is raised in height.
All modules can be equipped with optional functions such as automatic dispense systems for LabSpins or proximity-pins for Hot Plates. The MCS8 LabCluster is available as an array of up to six of these customizable frames each including two modules. This enables the combination up to twelve modules in total, thus offering a complete process solution.
The innovative design allows for up to two advanced coating and developing technologies to be added to the 6 basic frames in the cluster. These advanced systems come from the existing SUSS portfolio of tools, such as the RCD8 or AS8. This makes the MCS8 suitable for a broad spectrum of applications for MEMS fabrication, III-V research, electron beam lithography, temporary bonding, nano-imprinting, microfluidics and micro-optics. Customers can equip the MCS8 platform in a wide range of configurations based on their needs for maximum combined benefit.
Available options include, dispense systems for coaters; proximity-pins and purge options for hot plates; temperature control for developers; wide range of chucks.
MCS8 Manual Wafer Coating System Technical Downloads
File
SUSS MCS8 Manual Wafer Coating System
Download
Related Products
Manual Resist Spin Coating Machine

MORE
Manual Wafer Hot Plate

MORE
Semi-Automatic Resist Coat & Developers

MORE
Semi-Automatic Spray Coaters

MORE
Semiconductor Wafers

MORE
Knowledge Base Articles
Description
Description
Introduction to Photoresist Coatings (IKB-086)
Link
Description
Photo-resist Coating Methods (IKB-067)
Link
Description
What is Spin Coating? (IKB-075)
Link
Description
Photolithography Basics (IKB-038)
Link
Description
Imprint Photolithography (IKB-054)
Link
Description
Photolithography Exposure Modes (IKB-053)
Link
Further Information
What is Wafer Developing?
Wafer developing is the lithography step where the photoresist pattern formed during exposure is revealed using a chemical developer. Areas of the photoresist that have undergone a chemical change are selectively dissolved, leaving a defined resist pattern on the wafer surface.
The remaining photoresist acts as a temporary mask for subsequent processes such as etching or deposition, making accurate and repeatable development essential to device performance.
Key aspects of wafer developing include:
- Removal of exposed or unexposed photoresist, depending on resist type
- Use of controlled chemical developer solutions to reveal the lithographic pattern
- Formation of a resist mask for downstream processing for etching or implantation
- Critical influence on feature dimensions, edge definition and pattern fidelity
Inseto Knowledge Base Document:
Read our guide to the “Introduction to Photoresist Coatings“
Wiki – Semiconductor Device Fabrication
Applications:
UV Lithography, Wafer Resist Coating with Spin, Spray or Puddle Dispense, Resist Developing, Wafer Cleaning, Metal Layer Lift Off, Baking, Wafer Prime etc.
Industry Segments
Semiconductor research and development.
SUSS Website
Region
United Kingdom, Ireland, Sweden, Norway, Finland and Iceland
Request Form



Back to top