Manual Wafer Hot Plate
HP8 Manual Wafer Hot Plate Key Features
- Small Footprint Manual Wafer Hot Plate
- For up to 200mm Wafers and Substrates
- 250°C Maximum Temperature
- Programmable Heating Ramp in 1s steps
- Excellent Uniformity: ± 1% (± 0.5% < 120°C)
- N2 Purge, Lift Pins, Proximity Bake
- Stand Alone, Table Top or Bench Mounted
- Protection Coating of Hot Plate Surface
- Touchscreen Operation
The HP8 manual wafer hot plate for up to 200mm wafers/substrates from SUSS. The hot-plate has been designed to meet the requirements of precision R&D work and small scale production and is available in bench mounted, table-top or stand-alone versions.
Equipped with lift pins as a standard, this permits convenient and safe substrate handling. Nitrogen purge and vacuum suction of the substrate can also be individually selected for each step in the recipe editor.
The closed double walled lid ensures stable process conditions and prevents accidental touching of the hot surface by the operator.
In addition, the HP8 offers homogeneous temperature distribution by utilising special heating coils, as well as heating ramps with high repeating accuracy, to ensure constant and stable process results. The manual hotplate is an ideal companion tool for any lithographic production or research environment and is widely used in processing of the photo-resists and polymers at all fabrication levels.
SUSS also manufacture the LabSpin range of high-performance manual resist spin coat and puddle develop tools.
HP8 Technical Downloads
File
SUSS HP8 Hot Plate Datasheet
Download
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Knowledge Base Articles
Description
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What is Spin Coating? (IKB-075)
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Introduction to Photoresist Coatings (IKB-086)
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Photolithography Basics (IKB-038)
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Imprint Photolithography (IKB-054)
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Photolithography Exposure Modes (IKB-053)
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Further Information
What is a Wafer Hotplate?
Wafer hot plates are essential process tools in semiconductor fabrication, used to precisely heat wafers during critical steps of lithography and materials processing. They are most commonly employed for soft bake, post‑exposure bake and hard bake processes, where controlled heating is required to stabilise photoresists, drive off solvents and improve pattern definition before further processing.
Key aspects of a wafer hotplate include:
- Temperature Uniformity, for even heating to prevent defects & pattern distortion
- Process Stability ensuring repeatable bake conditions during lithography
- Material Conditioning, improving adhesion, resist performance and film quality
- Process Integration, preparing wafers for exposure or development processes
Inseto Knowledge Base Document:
Read our guide to the “Introduction to Photoresist Coatings“
Wiki – Semiconductor Device Fabrication
Wafer Hotplate Applications
Resist curing and baking
Industry Segments
Semiconductor research and development.
SUSS Website
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United Kingdom, Ireland, Sweden, Finland, Norway & Iceland
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