Anisotropic Conductive Die Attach Adhesives
DELO MONOPOX anisotropic adhesives are the market-leading adhesive of choice for RFID & smart-card applications.
What do Anisotropic Conductive Die Attach Adhesives do?
With excellent adhesion to a wide variety of substrates (FR4, gold-plated alumina, LCP, PETP, etc.) and an extended working life (up to 7 days for one particular adhesive), DELO’s anisotropic conductive die attach adhesives are ideal for flip-chip and BGA component bonding.
More detailed information on DELO’s range of die attach adhesives can be found here.
Key Features of DELO MONOPOX
- Conducts only in the vertical, or Z-axis, plane
- High bond strength
- Ultra-fast thermode-curing in seconds
- Very small particle size (~ 5µm) to endure no conductivity in X & Y planes
- High glass transition temperature (Tg) of ~ 150°C
Anisotropic Conductive Die Attach Adhesives Resources
File
Adhesives for Microelectronic Packaging
Download
File
DELO-DOT PN5 Series Microdispensing valves and cleaning station Brochure
Download
File
DELO-DOT RE Retraction Valve Brochure
Download
Reliable bonds achieved in seconds
DELO anisotropic conductive adhesives are particularly suitable for RFID applications, where reliable bonds must be achieved in seconds on temperature-sensitive substrates such as PET and paper. Smart labels, i.e. a label with a built-in chip and an antenna, transfer data from an RFID chip to a reader, resulting in an easy, automatic and contact-free process.
Suitable for manual to fully-automatic placement equipment
DELO anisotropic conductive adhesives are optimised for syringe dispensing, so can be used in manual to fully-automatic placement equipment.
Got a Question About Anisotropic Conductive Die Attach Adhesives?
Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help.
From selecting the right adhesive to optimising your curing process, we provide technical guidance, documentation, and samples to support your application needs.
Knowledge Base Articles
Description
Description
Adhesives for Die Attach (IKB-071)
Link
Description
Die Attach Process: Guidance and Setup (IKB-072)
Link
Description
Understanding Shear Test: Ball Bond and Die Shear (IKB-018)
Link
Description
MIL STD 883 Shear Testing (IKB-026)
Link
Description
Basic Adhesive Types (IKB-041)
Link
Description
How to Choose the Right Adhesive (IKB-035)
Link
Description
All Things Considered (IKB-042)
Link
Related Products
Further Information
Applications
Bonding, Sealing, Encapsulation, Potting, Protection Against Vibration, Securing, Dam & Fill
Industry Segments
Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.
Delo Website
Region
Available from Inseto in the United Kingdom & Ireland
Request Form
Back to top